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OR3T80-6PS240 参数 Datasheet PDF下载

OR3T80-6PS240图片预览
型号: OR3T80-6PS240
PDF下载: 下载PDF文件 查看货源
内容描述: 3C和3T现场可编程门阵列 [3C and 3T Field-Programmable Gate Arrays]
分类和应用: 现场可编程门阵列可编程逻辑
文件页数/大小: 210 页 / 4391 K
品牌: AGERE [ AGERE SYSTEMS ]
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Data Sheet  
June 1999  
ORCA Series 3C and 3T FPGAs  
Package Outline Diagrams (continued)  
352-Pin PBGA  
Dimensions are in millimeters.  
35.00 ± 0.20  
+0.70  
30.00  
–0.00  
A1 BALL  
IDENTIFIER ZONE  
+0.70  
30.00  
–0.00  
35.00  
± 0.20  
MOLD  
COMPOUND  
PWB  
1.17 ± 0.05  
0.56 ± 0.06  
2.33 ± 0.21  
SEATING PLANE  
0.20  
SOLDER BALL  
25 SPACES @ 1.27 = 31.75  
0.60 ± 0.10  
AF  
AE  
AD  
AC  
AB  
AA  
Y
W
0.75 ± 0.15  
V
U
T
R
P
N
25 SPACES  
@ 1.27 = 31.75  
M
L
K
J
H
G
F
E
D
C
CENTER ARRAY  
FOR THERMAL  
ENHANCEMENT  
(OPTIONAL)  
(SEE NOTE BELOW)  
B
A
1 2 3  
4
5 6  
7
8 9 10 12 14 16 18 20 22 24 26  
11 13 15 17 19 21 23 25  
A1 BALL  
CORNER  
5-4407(F)  
Note: Although the 36 thermal enhancement balls are stated as an option, they are standard on the 352 FPGA package.  
Lucent Technologies Inc.  
203  
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