Data Sheet
June 1999
ORCA Series 3C and 3T FPGAs
Package Outline Diagrams (continued)
240-Pin SQFP2
Dimensions are in millimeters.
34.60 ± 0.20
32.00 ± 0.20
24. 2 REF
1.30 REF
PIN #1 IDENTIFIER ZONE
240
181
1
180
0.25
GAGE PLANE
SEATING PLANE
0.50/0.75
24.2
RE F
DETAIL A
32.00
± 0.20
34.60
± 0.20
0.090/0.200
0.17/0.27
M
0.10
DETAIL B
60
121
61
120
EXPOSED HEAT SINK APPEARS ON BOTTOM
SURFACE: CHIP BONDED FACE UP. (SEE DETAIL C.)
DETAIL B
DETAIL A
3.40 ± 0.20
4.10 MAX
SEATING PLANE
0.08
0.50 TYP
0.25 MIN
CHIP BONDED FACE UP
CHIP
COPPER HEAT SINK
DETAIL C (SQFP2 CHIP-UP)
5-3825(F).a
Lucent Technologies Inc.
201
AGERE [ AGERE SYSTEMS ]
