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OR3T80-6PS240 参数 Datasheet PDF下载

OR3T80-6PS240图片预览
型号: OR3T80-6PS240
PDF下载: 下载PDF文件 查看货源
内容描述: 3C和3T现场可编程门阵列 [3C and 3T Field-Programmable Gate Arrays]
分类和应用: 现场可编程门阵列可编程逻辑
文件页数/大小: 210 页 / 4391 K
品牌: AGERE [ AGERE SYSTEMS ]
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Data Sheet  
June 1999  
ORCA Series 3C and 3T FPGAs  
Package Thermal Characteristics (continued)  
FPGA Maximum Junction Temperature  
Once the power dissipated by the FPGA has been determined (see the Estimating Power Dissipation section), the  
maximum junction temperature of the FPGA can be found. This is needed to determine if speed derating of the  
device from the 85 °C junction temperature used in all of the delay tables is needed. Using the maximum ambient  
temperature, TAmax, and the power dissipated by the device, Q (expressed in °C), the maximum junction tempera-  
ture is approximated by:  
TJmax = TAmax + (Q • ΘJA)  
Table 76 lists the plastic package thermal characteristics for the ORCA Series FPGAs.  
Table 76. Plastic Package Thermal Characteristics for the ORCA Series1  
ΘJA (°C/W)  
TA = 70 °C max  
TJ = 125 °C max  
@ 0 fpm (W)  
Package  
0 fpm  
200 fpm  
500 fpm  
208-Pin SQFP1  
208-Pin SQFP21  
240-Pin SQFP1  
240-Pin SQFP21  
256-Pin PBGA1, 2  
256-Pin PBGA1, 3  
352-Pin PBGA1, 2  
352-Pin PBGA1, 3  
432-Pin EBGA1  
600-Pin EBGA1  
26.5  
12.8  
25.5  
13.0  
22.5  
26.0  
19.0  
25.5  
11.0  
11.0  
23.0  
10.3  
22.5  
10.0  
19.0  
22.0  
16.0  
22.0  
8.5  
21.0  
9.1  
2.1  
4.3  
2.2  
4.2  
2.4  
2.1  
2.9  
2.1  
5.0  
5.5  
21.0  
9.0  
17.5  
20.5  
15.0  
20.5  
7.5  
8.5  
7.5  
1. Mounted on 4-layer JEDEC standard test board with two power/ground planes.  
2. With thermal balls connected to board ground plane.  
3. Without thermal balls connected to board ground plane.  
Lucent Technologies Inc.  
195