ADV7180
OUTLINE DIMENSIONS
6.00
BSC SQ
0.60 MAX
0.60 MAX
PIN 1
INDICATOR
31
40
1
30
PIN 1
INDICATOR
0.50
BSC
TOP
VIEW
4.25
4.10 SQ
3.95
5.75
BCS SQ
EXPOSED
PAD
(BOT TOM VIEW)
0.50
0.40
0.30
21
10
20
0.25 MIN
4.50
REF
12° MAX
0.80 MAX
0.65 TYP
EXPOSED PADDLE MUST BE SOLDERED
TO PCB GROUND FOR PROPER
HEAT DISSIPATION, NOISE IMMUNITY AND
MECHANICAL STRENGTH BENEFITS.
0.05 MAX
0.02 NOM
1.00
0.85
0.80
0.30
0.23
0.18
COPLANARITY
0.08
0.20 REF
SEATING
PLANE
COMPLIANT TO JEDEC STANDARDS MO-220-VJJD-2
Figure 55. 40-Lead Lead Frame Chip Scale Package [LFCSP_VQ]
6 mm × 6 mm Body, Very Thin Quad
(CP-40)
Dimensions shown in millimeters
12.20
12.00 SQ
11.80
0.75
0.60
0.45
1.60
MAX
64
49
1
48
PIN 1
10.20
10.00 SQ
9.80
TOP VIEW
(PINS DOWN)
1.45
1.40
1.35
0.20
0.09
7°
3.5°
0°
0.08
COPLANARITY
16
33
0.15
0.05
SEATING
PLANE
17
32
VIEW A
0.27
0.22
0.17
0.50
BSC
LEAD PITCH
VIEW A
ROTATED 90° CCW
COMPLIANT TO JEDEC STANDARDS MS-026-BCD
Figure 56. 64-Lead Low Profile Quad Flat Package [LQFP]
10 mm × 10 mm Body
(ST-64-2)
Dimensions shown in millimeters
ORDERING GUIDE
Model
ADV7180BCPZ1
ADV7180BSTZ1
EVAL-ADV7180LQEB
EVAL-ADV7180LFEB
Temperature Range
–40°C to +85°C
–40°C to +85°C
Package Description
Package Option
40-Lead Lead Frame Chip Scale Package [LFCSP_VQ]
64-Lead Low Profile Quad Flat Package [LQFP]
Evaluation Board for the LQFP
CP-40
ST-64-2
Evaluation Board for LFCSP
1 Z = Pb-free part.
Note: The ADV7180 is a Pb-free environmentally friendly product. It is manufactured using the most up-to-date materials and processes.
The coating on the leads of each device is 100% pure Sn electroplate. The device is suitable for Pb-free applications and can withstand
surface-mount soldering at up to 255°C ( 5°C).
In addition, it is backward-compatible with conventional SnPb soldering processes. This means the electroplated Sn coating can be
soldered with Sn/Pb solder pastes at conventional reflow temperatures of 220°C to 235°C.
Rev. A | Page 111 of 112
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