ADV7180
OUTLINE DIMENSIONS
6.00
BSC SQ
0.60 MAX
0.60 MAX
31
30
40
1
PIN 1
INDICATOR
PIN 1
INDICATOR
TOP
VIEW
5.75
BCS SQ
0.50
BSC
0.50
0.40
0.30
EXPOSED
PAD
(BOT TOM VIEW)
4.25
4.10 SQ
3.95
10
21
20
0.25 MIN
4.50
REF
12° MAX
0.80 MAX
0.65 TYP
0.05 MAX
0.02 NOM
1.00
0.85
0.80
EXPOSED PADDLE MUST BE SOLDERED
TO PCB GROUND FOR PROPER
HEAT DISSIPATION, NOISE IMMUNITY AND
MECHANICAL STRENGTH BENEFITS.
SEATING
PLANE
0.30
0.23
0.18
0.20 REF
COPLANARITY
0.08
COMPLIANT TO JEDEC STANDARDS MO-220-VJJD-2
Figure 55. 40-Lead Lead Frame Chip Scale Package [LFCSP_VQ]
6 mm × 6 mm Body, Very Thin Quad
(CP-40)
Dimensions shown in millimeters
12.20
12.00 SQ
11.80
64
1
PIN 1
49
48
0.75
0.60
0.45
1.60
MAX
TOP VIEW
(PINS DOWN)
10.20
10.00 SQ
9.80
1.45
1.40
1.35
0.15
0.05
SEATING
PLANE
0.20
0.09
7°
3.5°
0°
0.08
COPLANARITY
16
17
32
33
VIEW A
COMPLIANT TO JEDEC STANDARDS MS-026-BCD
Figure 56. 64-Lead Low Profile Quad Flat Package [LQFP]
10 mm × 10 mm Body
(ST-64-2)
Dimensions shown in millimeters
ORDERING GUIDE
Model
ADV7180BCPZ
ADV7180BSTZ
EVAL-ADV7180LQEB
EVAL-ADV7180LFEB
1
Temperature Range
–40°C to +85°C
–40°C to +85°C
Package Description
40-Lead Lead Frame Chip Scale Package [LFCSP_VQ]
64-Lead Low Profile Quad Flat Package [LQFP]
Evaluation Board for the LQFP
Evaluation Board for LFCSP
Z = Pb-free part.
Note: The ADV7180 is a Pb-free environmentally friendly product. It is manufactured using the most up-to-date materials and processes.
The coating on the leads of each device is 100% pure Sn electroplate. The device is suitable for Pb-free applications and can withstand
surface-mount soldering at up to 255°C (±5°C).
In addition, it is backward-compatible with conventional SnPb soldering processes. This means the electroplated Sn coating can be
soldered with Sn/Pb solder pastes at conventional reflow temperatures of 220°C to 235°C.
Rev. A | Page 111 of 112
051706-A
ROTATED 90° CCW
VIEW A
0.50
BSC
LEAD PITCH
0.27
0.22
0.17
Package Option
CP-40
ST-64-2
AD [ ANALOG DEVICES ]
