ADG1419
ABSOLUTE MAXIMUM RATINGS
TA = 25°C, unless otherwise noted.
THERMAL RESISTANCE
Table 5.
Parameter
Table 6. Thermal Resistance
Package Type
Rating
θJA
θJC
Unit
°C/W
°C/W
VDD to VSS
35 V
−0.3 V to +25 V
+0.3 V to −25 V
8-Lead MSOP (4-Layer Board)
8-Lead LFCSP
206
50.8
44
VDD to GND
VSS to GND
Analog Inputs1
VSS − 0.3 V to VDD + 0.3 V or
ESD CAUTION
30 mA, whichever occurs first
GND − 0.3 V to VDD + 0.3 V or
30 mA, whichever occurs first
Digital Inputs1
Peak Current, S or D
(Pulsed at 1 ms, 10%
Duty-Cycle Maximum)
8-Lead MSOP (4-Layer Board) 400 mA
8-Lead LFCSP
600 mA
Continuous Current per
Channel, S or D
Data in Table 4 + 15% mA
Operating Temperature Range
Industrial
Storage Temperature Range
Junction Temperature
−40°C to +125°C
−65°C to +150°C
150°C
Reflow Soldering Peak
Temperature, Pb Free
260°C
1 Over voltages at IN, S, or D are clamped by internal diodes. Current should
be limited to the maximum ratings given.
Stresses above those listed under Absolute Maximum Ratings
may cause permanent damage to the device. This is a stress
rating only; functional operation of the device at these or any
other conditions above those indicated in the operational
section of this specification is not implied. Exposure to absolute
maximum rating conditions for extended periods may affect
device reliability.
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