ADG1419
OUTLINE DIMENSIONS
3.20
3.00
2.80
8
1
5
4
5.15
4.90
4.65
3.20
3.00
2.80
PIN 1
IDENTIFIER
0.65 BSC
0.95
0.85
0.75
15° MAX
1.10 MAX
0.80
0.55
0.40
0.15
0.05
0.23
0.09
6°
0°
0.40
0.25
COPLANARITY
0.10
COMPLIANT TO JEDEC STANDARDS MO-187-AA
Figure 33. 8-Lead Mini Small Outline Package [MSOP]
(RM-8)
Dimensions shown in millimeters
1.75
2.00 BSC
1.65
1.50
5
8
3.00 BSC
1.90
1.80
1.65
EXPOSED
PAD
0.20 MIN
4
1
PIN 1
INDICATOR
INDEX
AREA
0.50
0.40
0.30
TOP VIEW
SIDE VIEW
BOTTOM VIEW
0.80
0.75
0.70
FOR PROPER CONNECTION OF
THE EXPOSED PAD, REFER TO
THE PIN CONFIGURATION AND
FUNCTION DESCRIPTIONS
0.15 REF
COPLANARITY
0.08
0.05 MAX
0.02 NOM
SECTION OF THIS DATA SHEET.
SEATING
PLANE
0.30
0.25
0.20
0.50
Figure 34. 8-Lead Lead Frame Chip Scale Package [LFCSP_WD]
3 mm × 2 mm Body, Very Very Thin, Dual Lead
(CP-8-4)
Dimensions shown in millimeters
ORDERING GUIDE
Model
Temperature Range
−40°C to +125°C
−40°C to +125°C
−40°C to +125°C
Package Description
Package Option
RM-8
RM-8
Branding
S1L
S1L
ADG1419BRMZ1
8-Lead Mini Small Outline Package [MSOP]
8-Lead Mini Small Outline Package [MSOP]
8-Lead Lead Frame Chip Scale Package [LFCSP_WD]
ADG1419BRMZ-REEL71
ADG1419BCPZ-REEL71
CP-8-4
1C
1 Z = RoHS Compliant Part.
Rev. 0 | Page 15 of 16
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