Data Sheet
ADF4360-3
OUTLINE DIMENSIONS
4.10
4.00 SQ
3.90
0.60 MAX
0.60 MAX
PIN 1
INDICATOR
1
18
19
24
0.50
BSC
PIN 1
INDICATOR
2.45
2.30 SQ
2.15
3.75 BSC
SQ
EXPOSED
PAD
(BOTTOM VIEW)
13
12
6
7
0.50
0.40
0.30
0.20 MIN
TOP VIEW
2.50 BCS
0.70 MAX
0.65 TYP
12° MAX
FOR PROPER CONNECTION OF
THE EXPOSED PAD, REFER TO
THE PIN CONFIGURATION AND
FUNCTION DESCRIPTIONS
1.00
0.85
0.80
0.05 MAX
0.02 NOM
SECTION OF THIS DATA SHEET.
COPLANARITY
0.08
0.30
0.23
0.18
SEATING
PLANE
0.20 REF
COMPLIANT TO JEDEC STANDARDS MO-220-VGGD-2
Figure 24. 24-Lead Lead Frame Chip Scale Package [LFCSP_VQ]
4 mm × 4 mm Body, Very Thin Quad (CP-24-2)
Dimensions shown in millimeters
ORDERING GUIDE
Model1
ADF4360-3BCPZ
ADF4360-3BCPZRL
ADF4360-3BCPZRL7
EV-ADF4360-3EB1Z
Temperature Range
−40°C to +85°C
−40°C to +85°C
−40°C to +85°C
Frequency Range
Package Description
24-Lead LFCSP_VQ
24-Lead LFCSP_VQ
24-Lead LFCSP_VQ
Package Option
1600 MHz to 1950 MHz
1600 MHz to 1950 MHz
1600 MHz to 1950 MHz
CP-24-2
CP-24-2
CP-24-2
Evaluation Board
1 Z = RoHS Compliant Part.
Rev. C | Page 23 of 24
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