MIL-PRF-38535K
APPENDIX J
J.3.10.1 Group A inspection. Group A inspection shall be performed on each inspection lot and shall consist of
electrical parameter tests specified for the specified device. Group A inspection may be performed in any order.
J.3.10.2 Group B inspection. Group B inspection shall be performed on each inspection lot, for each qualified
package type and lead finish. Group B shall consist of mechanical and environmental tests for the specified device
class. Resubmission procedures shall be documented in the QM plan. For solderability, a statistical sound sample
size (sample sizes indicated in TM 5005 of MIL-STD-883 are acceptable, as a minimum) consisting of leads from
several packages shall be tested with zero failures. The actual number shall be determined by the TRB and detailed
in the TCI procedures in the QM plan.
J.3.10.3 Group C inspection. Group C inspection shall include die related tests specified which are performed
periodically. Resubmission procedures shall be documented in the QM plan. Where group C end-points are done on
actual devices, group C end-points shall be specified in the device specification.
J.3.10.4 Group D inspection. Group D inspection shall include package related tests which are performed
periodically. Resubmission procedures shall be documented in the QM plan. Where group D end-points are done on
actual devices, group D end-points shall be specified in the device specification.
J.3.10.5 Group E inspection. When applicable, group E inspection shall include RHA tests on each wafer lot. The
post-irradiation parameter limits (PIPL), transient, and single event phenomenon (SEP) response (as applicable), and
test conditions shall be as specified in the device specification.
J.3.10.6 End-point tests for groups C, D, (E if applicable). End-point measurements and other specified post-test
measurements shall be made for each sample after completion of all other specified tests in the subgroup. The test
limits for the end-point measurements shall be the same as the test limits for the respective group A subgroup
inspections. Different end-points may be specified for group E tests in the detail specifications. Any additional
end-point electrical measurements may be performed at the discretion of the manufacturer.
J.3.10.7 End-of-line TCI testing (option 1). All microcircuits used in end-of-line TCI testing that meet the
requirements of this specification and the device specification and are subjected to destructive tests or which fail any
test shall not be shipped on the contract or order as acceptable QML product. They may, however, be delivered at
the request of the acquiring activity, if they are isolated from, and clearly identified so as to prevent their being
mistaken for acceptable product. Sample microcircuits, from lots which have passed quality assurance inspections or
tests and which have been subjected to mechanical or environmental tests specified in groups B, C, and D inspection
and not classified as destructive, may be shipped on the contract or order provided the test has been proven to be
nondestructive (see A.4.3.2.3) and each of the microcircuits subsequently passes final electrical tests in accordance
with the applicable device specification.
J.3.11 In-line TCI testing (option 2). In-line control testing shall be performed through the use of the approved
SEC or QML microcircuit. The in-line control test plan shall show how all the groups A, B, C, D, and E test conditions
are incorporated under statistical process control or process control to allow in-line control monitoring. The following
shall also be addressed. Groups A, B, C, D, and E requirements are found in tables II through V and table C-I.
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ACTEL [ Actel Corporation ]
