MIL-PRF-38535K
APPENDIX J
J.3 TCI AND SCREENING INFORMATION
J.3.1 Mask requirements (when applicable). If the mask shop is internal to the manufacturing organization, all
designs shall be checked for errors utilizing appropriate design rule checkers before start of the mask making. Before
use, the mask shall be inspected for flaws and errors. The final photolithographic mask to be used for QML
microcircuit wafer fabrication shall be compliant with the critical dimensions. Measurements shall show that the
pattern sizes and positions are consistent with the design rules. All masks shall be maintained under an inventory
control program which outlines the inspection and the release of masks to fabrication, recording of usage, cleaning
cycles, and maintenance repair. All conditions for removal of masks from inventory shall be documented.
J.3.1.1 Wafer fabrication process. The wafer fabrication process shall be monitored and controlled using a
standard evaluation circuit (SEC), technology characterization vehicle (TCV) or alternate assessment procedure, and
parametric monitors (PMs) in accordance with 3.4.1. The wafer fabrication sequence to produce finished wafers shall
be established with processing limits for each wafer fabrication step. Specific items to be addressed are detailed
below:
Procedure
Paragraph
Traceability
3.11
Lot travelers
As required (TRB determined)
A.3.5.5, A.3.5.8
H.3.2.1.3.2
C.3.4.1.3, H.3.2.1.2, H.3.2.1.4
C.3.4.1.2, H.3.4.3
H.3.2.2.2.1
Glassivation/passivation
Parametric monitors
Wafer acceptance
Standard evaluation circuits
Technology characterization vehicles
Rework
In accordance with QM plan
Internal conductors and metallization thickness In accordance with applicable design rules
J.3.2 Assembly process procedures. The following assembly process procedures shall be used, as applicable, to
assemble QML microcircuits. The manufacturer shall control all phases of the assembly line to ensure that
contamination from any source or equipment operation and human intervention does not degrade the reliability of the
assembly process or QML microcircuit. Specific items to be addressed are shown below:
Assembly and package procedure
Incoming inspection
Paragraph
H.3.2.1.5.b.6
Eutectic die attach
Non-eutectic die attach
TM 2010 of MIL-STD-883, H.3.2.1.5.1
TM 2010, TM 5011 of MIL-STD-883, H.3.2.1.5.1
(as applicable)
Internal visual
Hermeticity
Handling (electrostatic discharge (ESD))
Human contamination
Rework
TM 2010 of MIL-STD-883, 3.4.1.4 w
TM 1014 of MIL-STD-883, TM 1018 of MIL-STD-883
G.3.3.1 p or 3.4.1.4 v herein
3.4.1.4 x
J.3.2.1
Internal water vapor content
Wire bonding
TM 1018 of MIL-STD-883
3.4.1.4 q herein
J.3.2.1 Assembly rework requirements. All QML microcircuit rework procedures shall be certified and documented
in the quality management (QM) plan.
J.3.3 Internal visual inspection. Internal visual inspection shall be performed to the appropriate level of TM 2010 of
MIL-STD-883 Microcircuits awaiting pre-seal inspection, or other accepted, unsealed microcircuits awaiting further
processing shall be stored in a dry, inert, controlled environment until sealed. Alternate procedures, such as those
provided in TM 5004 of MIL-STD-883 or some other TRB approved alternate, may be used. For gallium arsenide
(GaAs) devices only, TM 5013 of MIL-STD-883 should be used.
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ACTEL [ Actel Corporation ]
