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5962-9958502QXC 参数 Datasheet PDF下载

5962-9958502QXC图片预览
型号: 5962-9958502QXC
PDF下载: 下载PDF文件 查看货源
内容描述: [Field Programmable Gate Array, 36000 Gates, 2414-Cell, CMOS, CQFP256, CERAMIC, QFP-256]
分类和应用: 可编程逻辑
文件页数/大小: 217 页 / 1554 K
品牌: ACTEL [ Actel Corporation ]
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MIL-PRF-38535K  
APPENDIX J  
J.3.9.1 General. Any QML or SEC integrated circuit used for either TCI option (see J.3.10 or J.3.11) shall be  
screened in accordance with 4.2.  
J.3.9.2 TCI reporting. Summary of TCI tests analysis shall be submitted to the qualifying activity in accordance  
with 3.9.1 requirements. If TCI requirements are not met, the TRB shall notify the qualifying activity immediately and  
all products manufactured and delivered between the last TCI and the failed TCI shall be placed in suspect status.  
The manufacturer shall analyze the failure, determine the reason for failure and submit a corrective action plan. An  
assessment of whether to recall all suspect products shall be made by the TRB and the qualifying activity shall be  
notified of the decision. Recertification and requalification of the QML line may be required based on the nature of  
the problem and action taken by the manufacturer. Procedures for end-of-line TCI and in-line TCI testing for a QML  
line are described in the following paragraphs.  
J.3.9.3 Technology conformance inspection of multi-product wafer lots . If a Multi-Product Wafer (MPW) has been  
qualified then TCI testing sampling plan must be documented based on the same criteria used to establish the  
qualification criteria specified in section H.3.4.8.  
a. SEM inspection shall be performed per TM 2018, (class level S only); Worst case representative design  
only.  
b. Life test shall be performed per TM 1005; Worst case representative design only and 5 pieces sample on all  
other designs for class level S.  
c. Total Ionizing Dose (TID) shall be performed per TM 1019; Worst case representative design only and  
5 pieces sample on all other designs for class level S.  
Note: If a test failure is encountered then all designs shall be reviewed to determine whether the test failure is related  
to all designs or the specific design that failed the test. This analysis shall be applicable to burn-in PDA, qualification,  
and TCI failures.  
J.3.10 End-of-line TCI (option 1). End-of-line TCI testing shall be performed every TCI interval, as recommended  
in table J-1 herein. Quality conformance inspection (QCI) requirements as detailed in TM 5005 of MIL-STD-883 may  
be used, with qualifying activity (QA) approval, in place of the TCI requirements herein. Each end-of-line TCI vehicle  
shall pass the end-of-line quality conformance. All groups A, B, and E (as applicable) testing shall be performed on  
microcircuits to be delivered as QML microcircuits. Groups C and D testing shall be done on either the SEC or QML  
microcircuits. Groups A, B, C, D, and E requirements are found in tables II through V and table C-I herein.  
Group E inspection is required only for parts intended to be marked as radiation hardness assurance (RHA) (see  
3.4.3). RHA TCI sample tests shall be performed at the level(s) specified and in accordance with appendix C. The  
applicable subgroups of group E, (see appendix C) shall be performed when specified in the acquisition document.  
The actual devices used for group E testing shall be assembled in a qualified package and, as a minimum, shall pass  
table III, group A, subgroups 1, 7, and 9 at +25°C prior to irradiation.  
NOTE: If a manufacturer elects to eliminate a TCI step by substituting an in-process control or statistical process  
control procedure, the manufacturer is only relieved of the responsibility of performing the TCI operation associated  
with that step. The manufacturer is still responsible for providing a product that meets all of the performance,  
quality, and reliability requirements herein and in the device specification. Documentation supporting substitution  
for TCI shall be retained by the manufacturer and available to the QA upon request.  
Each group may contain individual subgroups for the purposes of identifying individual tests or groups of tests.  
Subgroups within a group of tests may be performed in any sequence but individual tests within a subgroup (except  
table II, group B, subgroup 2) shall be performed in the sequence indicated for groups B, C, D, and E tests herein.  
Electrical reject devices from the same inspection lot may be used for all subgroups when electrical end-point  
measurements are not required.  
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