MIL-PRF-38535K
APPENDIX J
J.3.4 Constant acceleration. All microcircuits shall be subjected to constant acceleration, except as modified in
accordance with 4.2 in the Y1 axis only, in accordance with TM 2001 of MIL-STD-883, condition E (minimum).
Microcircuits which are contained in packages that have an inner seal or cavity perimeter of two inches or more in
total length, or have a package mass of five grams or more, may be tested by replacing condition E with condition D
in TM 2001 of MIL-STD-883. For packages that cannot tolerate the stress level of condition D, the manufacturer shall
have data to justify a reduction in the stress level. The reduced stress level shall be specified in the manufacturers
QM plan. The minimum stress level allowed in this case is condition A.
J.3.5 Burn-in. Burn-in shall be performed on all QML microcircuits, except as modified in accordance with section
4.2, at or above their maximum rated operating temperature (for devices to be delivered as wafer or die, burn-in of
packaged samples from the lot shall be performed to a quantity accept level of 10(0)). For microcircuits whose
maximum operating temperature is stated in terms of ambient temperature (TA), table I of TM 1015 of MIL-STD-883
applies. For microcircuits whose maximum operating temperature is stated in terms of case temperature (TC), and
where the ambient temperature would cause TJ to exceed +175°C, the ambient operating temperature may be
reduced during burn-in from +125°C to a value that will demonstrate a TJ between +175°C and +200°C and TC equal
to or greater than +125°C without changing the test duration. Data supporting this reduction shall be available to the
acquiring and qualifying activities upon request.
J.3.6 Final electrical measurements. Final electrical testing of microcircuits shall assure that the microcircuits
tested meet the electrical requirements of the device specification and shall include the tests of table III, group A,
subgroups 1, 2, 3, 4 or 7, 5 and 6 or 8, and 9, 10, and 11, unless otherwise specified in the device specification.
J.3.7 Seal (fine and gross leak) testing. Fine and gross leak seal tests shall be performed, as specified in 4.2,
between temperature cycling and final electrical testing after all shearing and forming operations on the terminals in
accordance with TM 1014 of MIL-STD-883.
J.3.8 Pattern failures. Pattern failure criteria may be used as an option for any screen provided that pre burn-in
testing is done. When acceptance is based on pattern failures (multiple device failures - two or more caused by the
same basic failure mechanism) shall apply as specified in the acquisition document. If not otherwise specified, the
maximum allowable failures shall be five devices for each failure pattern established. Accountability shall include
burn-in through final electrical test.
J.3.8.1 Pattern failure rejects. When the number of pattern failures exceeds the specified limits, the burn-in lot
shall be rejected. At the manufacturer's TRB option, the rejected lot may be resubmitted to burn-in one time
provided:
a. The cause of the failure has been determined and evaluated.
b. Appropriate and effective corrective action has been completed to reject all microcircuits affected by the
failure cause.
c. Appropriate preventive action has been initiated.
J.3.9 TCI. TCI testing shall be accomplished by the manufacturer on a periodic basis to assure that the
manufacturer's quality, reliability, and performance capabilities meet the requirements of the QM plan. The
manufacturer of QML microcircuits shall be certified by the qualifying activity to use one or a combination of both of
the TCI procedures described below. The two TCI procedures are end-of-line TCI (option 1, see J.3.10) and in-line
TCI testing (option 2, see J.3.11).
NOTE: All tests may not be appropriate for the technology (e.g., for wafer or die product, group B, subgroups 1
and 3 and group D do not apply). The manufacturer's TRB shall determine that the appropriate tests are
completed to assure conformance of the product to be delivered.
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ACTEL [ Actel Corporation ]
