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5962-0421901QYC 参数 Datasheet PDF下载

5962-0421901QYC图片预览
型号: 5962-0421901QYC
PDF下载: 下载PDF文件 查看货源
内容描述: [Field Programmable Gate Array, 250000 Gates, 4224-Cell, CMOS, CQFP208, CERAMIC, QFP-208]
分类和应用: 可编程逻辑
文件页数/大小: 217 页 / 1554 K
品牌: ACTEL [ Actel Corporation ]
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MIL-PRF-38535K  
CONTENTS  
PARAGRAPH  
PAGE  
A.4.5.4.1 Group C sample selection............................................................................................................................81  
A.4.5.4.1.1 Microcircuit group assignments ................................................................................................................81  
A.4.5.4.1.2 Product acceptable for delivery.................................................................................................................81  
A.4.5.5 Group D inspection.........................................................................................................................................81  
A.4.5.5.1 Group D sample selection............................................................................................................................84  
A.4.5.5.2 Incoming vendor material control program...................................................................................................84  
A.4.5.6 Group E inspection .........................................................................................................................................84  
A.4.5.6.1 Group E sample selection............................................................................................................................84  
A.4.5.7 End-point tests for groups B, C, and D (and E if applicable) inspections........................................................84  
A.4.5.8 Nonconformance ............................................................................................................................................85  
A.4.5.8.1 Group B failure.............................................................................................................................................85  
A.4.5.8.2 Alternate group B failure..............................................................................................................................85  
A.4.5.8.3 Group C failure ............................................................................................................................................86  
A.4.5.8.4 Group D failure ............................................................................................................................................86  
A.4.6 Screening...........................................................................................................................................................86  
A.4.6.1 Burn-in............................................................................................................................................................86  
A.4.6.1.1 Lots and sublots resubmitted for burn-in......................................................................................................86  
A.4.6.1.2 Burn-in acceptance criteria ..........................................................................................................................87  
A.4.6.1.2.1 Failure analysis of burn-in screen failures for class level S devices .........................................................87  
A.4.6.2 External visual screen.....................................................................................................................................87  
A.4.6.3 Particle impact noise detection (PIND) test for class level S devices .............................................................87  
A.4.6.4 Lead forming...................................................................................................................................................87  
A.4.6.5 Nondestructive bond pull test for class level S devices...................................................................................87  
A.4.7 Test results ........................................................................................................................................................88  
A.4.7.1 Screening test data for class level S microcircuits..........................................................................................88  
A.4.8 Quality assurance program................................................................................................................................88  
A.4.8.1 Manufacturer certification................................................................................................................................88  
A.4.8.1.1 Design, processing, manufacturing, and testing instructions.......................................................................89  
A.4.8.1.1.1 Conversion of customer requirements into manufacturer's internal instructions.......................................89  
A.4.8.1.1.2 Personnel training and testing ..................................................................................................................89  
A.4.8.1.1.3 Inspection of incoming materials and utilities, and of work in-process......................................................89  
A.4.8.1.1.4 Quality control operations .........................................................................................................................89  
A.4.8.1.1.5 Quality assurance operations ...................................................................................................................89  
A.4.8.1.1.6 Design, processing, manufacturing equipment, and materials instructions...............................................91  
A.4.8.1.1.7 Cleanliness and atmosphere control in work areas ..................................................................................91  
A.4.8.1.1.8 Design, material, and process change control..........................................................................................91  
A.4.8.1.1.9 Tool, gauge, and test equipment maintenance and calibration.................................................................91  
A.4.8.1.1.10 Failure and defect analysis and feedback...............................................................................................92  
A.4.8.1.1.11 Corrective action and evaluation.............................................................................................................92  
A.4.8.1.1.12 Incoming, in-process, and outgoing inventory control.............................................................................92  
A.4.8.1.1.13 Schematics .............................................................................................................................................92  
A.4.8.1.1.14 ESD handling control program................................................................................................................92  
A.4.8.1.2 Records to be maintained............................................................................................................................92  
A.4.8.1.2.1 Personnel training and testing ..................................................................................................................94  
A.4.8.1.2.1.1 Training of operators and inspectors......................................................................................................94  
A.4.8.1.2.2 Inspection operations................................................................................................................................94  
A.4.8.1.2.3 Failure and defect reports and analyses...................................................................................................94  
A.4.8.1.2.4 Initial documentation and subsequent changes in design, materials, or processing.................................94  
A.4.8.1.2.5 Equipment calibrations..............................................................................................................................95  
A.4.8.1.2.6 Process, utility, and material controls........................................................................................................95  
A.4.8.1.2.7 Product lot identification............................................................................................................................95  
A.4.8.1.2.8 Product traceability ...................................................................................................................................95  
A.4.8.1.3 Quality assurance program plan..................................................................................................................95  
A.4.8.1.3.1 Functional block organization chart ..........................................................................................................96  
A.4.8.1.3.2 Examples of manufacturing flowchart.......................................................................................................96  
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