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5962-0421901QYC 参数 Datasheet PDF下载

5962-0421901QYC图片预览
型号: 5962-0421901QYC
PDF下载: 下载PDF文件 查看货源
内容描述: [Field Programmable Gate Array, 250000 Gates, 4224-Cell, CMOS, CQFP208, CERAMIC, QFP-208]
分类和应用: 可编程逻辑
文件页数/大小: 217 页 / 1554 K
品牌: ACTEL [ Actel Corporation ]
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MIL-PRF-38535K  
CONTENTS  
PARAGRAPH  
PAGE  
G.3.2.1 Organizational structure ...............................................................................................................................138  
G.3.2.2 TRB duties....................................................................................................................................................138  
G.3.2.2.1 QML certification and qualification test plan (see G.3.3g) .........................................................................140  
G.3.2.3 Status report.................................................................................................................................................140  
G.3.3 QM plan...........................................................................................................................................................141  
G.3.3.1 QM plan outline ............................................................................................................................................141  
G.3.4 Change control procedures.............................................................................................................................143  
G.3.4.1 Design methodology change........................................................................................................................144  
G.3.4.2 Fabrication process change .........................................................................................................................144  
G.3.4.3 Assembly process change............................................................................................................................145  
G.3.4.4 Package change...........................................................................................................................................146  
G.3.4.5 Test facility change.......................................................................................................................................146  
H.1 SCOPE...............................................................................................................................................................148  
H.1.1 Scope ..............................................................................................................................................................148  
H.2 APPLICABLE DOCUMENTS..............................................................................................................................148  
H.2.1 General............................................................................................................................................................148  
H.2.2 Government documents ..................................................................................................................................148  
H.2.2.1 Specifications, standards, and handbooks ...................................................................................................148  
H.2.3 Non-Government publications .........................................................................................................................149  
H.2.4 Order of precedence........................................................................................................................................149  
H.3 REQUIREMENTS...............................................................................................................................................150  
H.3.1 General............................................................................................................................................................150  
H.3.1.1 Characterization requirements......................................................................................................................150  
H.3.1.2 Certification...................................................................................................................................................150  
H.3.1.3 Validation......................................................................................................................................................150  
H.3.1.4 Transitional certification................................................................................................................................150  
H.3.1.5 Qualification requirements............................................................................................................................150  
H.3.1.6 New technology requirements ......................................................................................................................150  
H.3.1.7 Mature technology requirements ..................................................................................................................150  
H.3.1.8 General QML process flows .........................................................................................................................150  
H.3.1.9 Overview of QML Approval Process.............................................................................................................153  
H.3.1.10 Manufacturer’s Responsibility.....................................................................................................................154  
H.3.1.11 Qualifying Activity (QA) Responsibility........................................................................................................154  
H.3.2 Certification......................................................................................................................................................154  
H.3.2.1 Design, Wafer Fabrication, Assembly, and Test Certification.......................................................................154  
H.3.2.1.1 Design .......................................................................................................................................................154  
H.3.2.1.1.1 Circuit design..........................................................................................................................................154  
H.3.2.1.1.2 Design checklist (Class level S)..............................................................................................................155  
H.3.2.1.1.3 Package Design .....................................................................................................................................156  
H.3.2.1.2 Wafer fabrication .......................................................................................................................................157  
H.3.2.1.2.1 Wafer fabrication checklist (Class level S)..............................................................................................157  
H.3.2.1.3 SPC and in-process monitoring program...................................................................................................158  
H.3.2.1.3.1 SPC and in-process monitoring checklist (Class level S) .......................................................................159  
H.3.2.1.3.2 Parametric monitor .................................................................................................................................160  
H.3.2.1.4 Wafer acceptance plan..............................................................................................................................162  
H.3.2.1.5 Assembly and packaging...........................................................................................................................163  
H.3.2.1.5 Assembly and packaging technology certification .....................................................................................163  
H.3.2.1.6 SPC and in-process monitoring program...................................................................................................164  
H.3.2.1.7 Test capability............................................................................................................................................164  
H.3.2.1.7 Certification approval.................................................................................................................................164  
H.3.2.2 Physics-of-failure/TCV reliability assessment...............................................................................................164  
H.3.2.2.1 Reliability assessment plan .......................................................................................................................164  
H.3.2.2.2 TCV program.............................................................................................................................................164  
H.3.2.2.2.1 TCV certification .....................................................................................................................................165  
H.3.2.2.3 Assembly and packaging...........................................................................................................................166  
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