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5962-0421901QYC 参数 Datasheet PDF下载

5962-0421901QYC图片预览
型号: 5962-0421901QYC
PDF下载: 下载PDF文件 查看货源
内容描述: [Field Programmable Gate Array, 250000 Gates, 4224-Cell, CMOS, CQFP208, CERAMIC, QFP-208]
分类和应用: 可编程逻辑
文件页数/大小: 217 页 / 1554 K
品牌: ACTEL [ Actel Corporation ]
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MIL-PRF-38535K  
CONTENTS  
PARAGRAPH  
PAGE  
6.4.16 Die type............................................................................................................................................................36  
6.4.17 Radiation hardness assurance (RHA)..............................................................................................................36  
6.4.18 Electrostatic discharge (ESD) sensitivity..........................................................................................................36  
6.4.19 Package family.................................................................................................................................................36  
6.4.20 Technology flow ...............................................................................................................................................36  
6.4.21 Qualified Manufacturer's Listing (QML)............................................................................................................36  
6.4.22 Third party design center..................................................................................................................................36  
6.4.23 Radiation source of supply (RSS) ....................................................................................................................36  
6.4.24 Form.................................................................................................................................................................36  
6.4.25 Fit.....................................................................................................................................................................36  
6.4.26 Function ...........................................................................................................................................................36  
6.4.27 Class M............................................................................................................................................................37  
6.4.28 Class N.............................................................................................................................................................37  
6.4.29 Class Q ............................................................................................................................................................37  
6.4.30 Class V.............................................................................................................................................................37  
6.4.31 Class Y.............................................................................................................................................................37  
6.4.32 Class B.............................................................................................................................................................37  
6.4.33 Class S.............................................................................................................................................................37  
6.4.34 Class T.............................................................................................................................................................37  
6.4.35 Qualified manufacturer’s line............................................................................................................................37  
6.4.36 Test optimization..............................................................................................................................................37  
6.4.37 Audit team........................................................................................................................................................37  
6.4.38 Class level B ....................................................................................................................................................37  
6.4.39 Class level S ....................................................................................................................................................37  
6.4.40 Class level vs Class .........................................................................................................................................38  
6.4.41 Second party facility.........................................................................................................................................38  
6.4.42 Third party facility.............................................................................................................................................38  
6.4.43 New technology................................................................................................................................................38  
6.4.44 Mature technology............................................................................................................................................38  
6.4.45 Lot date code ...................................................................................................................................................38  
6.4.46 Storage temperature ........................................................................................................................................38  
6.4.47 Multi-product wafer(MPW)................................................................................................................................38  
6.4.48 Package integrity demonstration test plan(PIDTP)...........................................................................................38  
6.5 Discussion.............................................................................................................................................................39  
6.6 Additional reference documents............................................................................................................................41  
6.7 Subject term (key word) listing ..............................................................................................................................42  
6.8 List of acronyms....................................................................................................................................................43  
6.9 Environmentally preferable material......................................................................................................................45  
6.10 Changes from previous issue..............................................................................................................................45  
A.1 SCOPE.................................................................................................................................................................46  
A.1.1 Scope.................................................................................................................................................................46  
A.2 APPLICABLE DOCUMENTS................................................................................................................................46  
A.2.1 General..............................................................................................................................................................46  
A.2.2 Government documents.....................................................................................................................................46  
A.2.2.1 Specifications, standards, and handbooks......................................................................................................46  
A.2.2.2 Other Government documents, drawings, and publications............................................................................47  
A.2.3 Non-Government publications ...........................................................................................................................47  
A.2.4 Order of precedence..........................................................................................................................................48  
A.3 REQUIREMENTS.................................................................................................................................................48  
A.3.1 General..............................................................................................................................................................48  
A.3.1.1 Reference to device specification or drawing..................................................................................................48  
A.3.1.2 Conflicting requirements .................................................................................................................................49  
A.3.1.3 Terms, definitions, symbols and requirements................................................................................................49  
A.3.1.3.1 Microelectronics...........................................................................................................................................49  
A.3.1.3.2 Element (of a microcircuit or integrated circuit)............................................................................................49  
iv  
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