欢迎访问ic37.com |
会员登录 免费注册
发布采购

5962-0421901QYC 参数 Datasheet PDF下载

5962-0421901QYC图片预览
型号: 5962-0421901QYC
PDF下载: 下载PDF文件 查看货源
内容描述: [Field Programmable Gate Array, 250000 Gates, 4224-Cell, CMOS, CQFP208, CERAMIC, QFP-208]
分类和应用: 可编程逻辑
文件页数/大小: 217 页 / 1554 K
品牌: ACTEL [ Actel Corporation ]
 浏览型号5962-0421901QYC的Datasheet PDF文件第2页浏览型号5962-0421901QYC的Datasheet PDF文件第3页浏览型号5962-0421901QYC的Datasheet PDF文件第4页浏览型号5962-0421901QYC的Datasheet PDF文件第5页浏览型号5962-0421901QYC的Datasheet PDF文件第7页浏览型号5962-0421901QYC的Datasheet PDF文件第8页浏览型号5962-0421901QYC的Datasheet PDF文件第9页浏览型号5962-0421901QYC的Datasheet PDF文件第10页  
MIL-PRF-38535K  
CONTENTS  
PARAGRAPH  
PAGE  
A.3.4.1.4 Qualification to ESD classes........................................................................................................................58  
A.3.4.2 Changes and notification of change to product or quality assurance program ...............................................59  
A.3.4.2.1 Discontinuation of products..........................................................................................................................59  
A.3.4.3 Screening........................................................................................................................................................59  
A.3.4.4 Quality conformance inspection (QCI)............................................................................................................59  
A.3.4.5 Wafer lot acceptance......................................................................................................................................59  
A.3.4.6 Traceability .....................................................................................................................................................59  
A.3.4.6.1 Lot travelers.................................................................................................................................................59  
A.3.4.7 Government source inspection .......................................................................................................................59  
A.3.5 Design and construction ....................................................................................................................................59  
A.3.5.1 Package..........................................................................................................................................................60  
A.3.5.1.1 Polymeric materials......................................................................................................................................60  
A.3.5.1.2 Package configurations................................................................................................................................60  
A.3.5.2 Metals.............................................................................................................................................................60  
A.3.5.3 Other materials ...............................................................................................................................................60  
A.3.5.4 Design documentation....................................................................................................................................60  
A.3.5.4.1 Die topography ............................................................................................................................................60  
A.3.5.4.2 Die intraconnection pattern..........................................................................................................................60  
A.3.5.4.3 Die to terminal interconnection ....................................................................................................................61  
A.3.5.4.4 Schematic diagrams ....................................................................................................................................61  
A.3.5.5 Internal conductors .........................................................................................................................................61  
A.3.5.5.1 Metallization thickness.................................................................................................................................63  
A.3.5.5.2 Internal wire size and material .....................................................................................................................63  
A.3.5.5.3 Internal lead wires........................................................................................................................................64  
A.3.5.5.4 Verification of glassivation layer integrity.....................................................................................................64  
A.3.5.6 Package element material and finish..............................................................................................................64  
A.3.5.6.1 Package material.........................................................................................................................................64  
A.3.5.6.2 Lead or terminal material.............................................................................................................................65  
A.3.5.6.3 Microcircuit finishes......................................................................................................................................65  
A.3.5.6.3.1 Finish thickness measurements................................................................................................................65  
A.3.5.6.3.2 Lead finish ................................................................................................................................................66  
A.3.5.6.3.3 Package element (other than lead or terminal) finish................................................................................66  
A.3.5.6.3.4 Hot solder dip............................................................................................................................................66  
A.3.5.6.3.5 Tin-lead plate............................................................................................................................................67  
A.3.5.7 Die plating and mounting................................................................................................................................67  
A.3.5.8 Glassivation ....................................................................................................................................................69  
A.3.5.9 Die thickness ..................................................................................................................................................70  
A.3.5.10 Laser scribing ...............................................................................................................................................70  
A.3.5.11 Internal lead separation for class level S devices .........................................................................................70  
A.3.6 Marking of microcircuits.....................................................................................................................................70  
A.3.6.1 Index point ......................................................................................................................................................70  
A.3.6.2 PIN..................................................................................................................................................................71  
A.3.6.2.1 Military designator........................................................................................................................................71  
A.3.6.2.2 RHA designator ...........................................................................................................................................71  
A.3.6.2.3 Device specification.....................................................................................................................................71  
A.3.6.2.4 Device type..................................................................................................................................................71  
A.3.6.2.5 Device class.................................................................................................................................................71  
A.3.6.2.6 Case outline.................................................................................................................................................71  
A.3.6.2.7 Lead finish ...................................................................................................................................................71  
A.3.6.2.8 Drawing designator......................................................................................................................................71  
A.3.6.3 Identification codes.........................................................................................................................................72  
A.3.6.3.1 Class level B die fabrication date code........................................................................................................72  
A.3.6.3.2 Inspection lot identification code for class levels S and B............................................................................72  
A.3.6.4 Manufacturer's identification ...........................................................................................................................72  
A.3.6.5 Manufacturer's designating symbol.................................................................................................................72  
vi  
 复制成功!