欢迎访问ic37.com |
会员登录 免费注册
发布采购

5962-0421901QYC 参数 Datasheet PDF下载

5962-0421901QYC图片预览
型号: 5962-0421901QYC
PDF下载: 下载PDF文件 查看货源
内容描述: [Field Programmable Gate Array, 250000 Gates, 4224-Cell, CMOS, CQFP208, CERAMIC, QFP-208]
分类和应用: 可编程逻辑
文件页数/大小: 217 页 / 1554 K
品牌: ACTEL [ Actel Corporation ]
 浏览型号5962-0421901QYC的Datasheet PDF文件第1页浏览型号5962-0421901QYC的Datasheet PDF文件第2页浏览型号5962-0421901QYC的Datasheet PDF文件第4页浏览型号5962-0421901QYC的Datasheet PDF文件第5页浏览型号5962-0421901QYC的Datasheet PDF文件第6页浏览型号5962-0421901QYC的Datasheet PDF文件第7页浏览型号5962-0421901QYC的Datasheet PDF文件第8页浏览型号5962-0421901QYC的Datasheet PDF文件第9页  
MIL-PRF-38535K  
CONTENTS  
PARAGRAPH  
PAGE  
3.6.3.2 JAN or J mark .................................................................................................................................................14  
3.6.4 Manufacturer's identification...............................................................................................................................14  
3.6.4.1 Code for assembly sites..................................................................................................................................14  
3.6.5 Country of origin.................................................................................................................................................14  
3.6.6 Date code...........................................................................................................................................................14  
3.6.7 Marking location and sequence..........................................................................................................................14  
3.6.7.1 Beryllium oxide package identifier...................................................................................................................14  
3.6.7.2 Electrostatic discharge (ESD) sensitivity identifier ..........................................................................................14  
3.6.8 QML marked product .........................................................................................................................................15  
3.6.9 Marking on container..........................................................................................................................................15  
3.7 Remarking.............................................................................................................................................................15  
3.8 Screening and test ................................................................................................................................................15  
3.9 Technology conformance inspection (TCI)............................................................................................................15  
3.9.1 TCI assessment .................................................................................................................................................15  
3.10 Solderability.........................................................................................................................................................15  
3.11 Traceability..........................................................................................................................................................15  
3.12 ESD control.........................................................................................................................................................15  
3.13 Recycled, recovered, or environmentally preferable materials............................................................................15  
3.14 Alternate test requirements.................................................................................................................................16  
3.15 Passive elements................................................................................................................................................16  
3.15.1 Capacitors........................................................................................................................................................16  
4. VERIFICATION.......................................................................................................................................................17  
4.1 Verification ............................................................................................................................................................17  
4.2 Screening..............................................................................................................................................................17  
4.2.1 Screen testing failures........................................................................................................................................17  
4.2.2 Screening resubmission criteria .........................................................................................................................17  
4.2.3 Electrostatic discharge (ESD) sensitivity............................................................................................................17  
4.3 Technology conformance inspection (TCI)............................................................................................................17  
4.4 Qualification inspection .........................................................................................................................................17  
5. PACKAGING...........................................................................................................................................................34  
5.1 Packaging .............................................................................................................................................................34  
6. NOTES....................................................................................................................................................................34  
6.1 Intended use .........................................................................................................................................................34  
6.1.1 Class T...............................................................................................................................................................34  
6.2 Acquisition requirements.......................................................................................................................................34  
6.3 Qualification ..........................................................................................................................................................34  
6.4 Terms and definitions............................................................................................................................................34  
6.4.1 Microelectronics .................................................................................................................................................34  
6.4.2 Element (of a microcircuit or integrated circuit) ..................................................................................................34  
6.4.3 Substrate (of a microcircuit or integrated circuit)................................................................................................35  
6.4.4 Integrated circuit (microcircuit) ...........................................................................................................................35  
6.4.4.1 Multichip microcircuit.......................................................................................................................................35  
6.4.4.2 Monolithic microcircuit.....................................................................................................................................35  
6.4.4.3 Microcircuit module .........................................................................................................................................35  
6.4.5 Production lot .....................................................................................................................................................35  
6.4.6 Inspection lot......................................................................................................................................................35  
6.4.7 Wafer lot.............................................................................................................................................................35  
6.4.8 Percent defective allowable (PDA).....................................................................................................................35  
6.4.9 Delta limit ...........................................................................................................................................................35  
6.4.10 Rework.............................................................................................................................................................35  
6.4.11 Final seal..........................................................................................................................................................35  
6.4.12 Acquiring activity ..............................................................................................................................................36  
6.4.13 Qualifying activity (QA).....................................................................................................................................36  
6.4.14 Parts per million (PPM) ....................................................................................................................................36  
6.4.15 Device type ......................................................................................................................................................36  
iii  
 复制成功!