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5962-0421901QYC 参数 Datasheet PDF下载

5962-0421901QYC图片预览
型号: 5962-0421901QYC
PDF下载: 下载PDF文件 查看货源
内容描述: [Field Programmable Gate Array, 250000 Gates, 4224-Cell, CMOS, CQFP208, CERAMIC, QFP-208]
分类和应用: 可编程逻辑
文件页数/大小: 217 页 / 1554 K
品牌: ACTEL [ Actel Corporation ]
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MIL-PRF-38535K  
3.4.8.1 Class T radiation requirements. The device specification shall define all the radiation features offered by the QML  
manufacturer for the class T device. QML manufacturers supplying class T devices shall meet the requirements of TM 1019 of  
MIL-STD-883 and shall document in the QM plan the RHA level specified for the device offered. All devices supplied to this  
product class shall be marked with a RHA designator as specified in 3.4.3 herein. Traceability shall be established such that  
there is a technical basis for compliance to the specified RHA level designator as marked on the device.  
3.5 Device specification. MIL-HDBK-780 details the SMD format to be used (SMD's are to be used except where the  
device specification is a MIL-M-38510 device specification or an altered item drawing is required by the device specification or  
SMD) and data requirements to be submitted with any device procured under this specification. The QML certification mark  
shall not be used until the device specification is approved (see 3.6.3).  
3.6 Marking of microcircuits. Marking of QML microcircuits shall be in accordance with the following and the identification  
and marking provisions of the device specification or drawing. The marking shall be legible and complete. If any special  
marking (e.g., altered item drawing number) is used by the device supplier or user/equipment contractor, it shall be in addition  
to the existing/original marking as required herein and shall be visibly separate from and in no way interfere with the marking  
required herein. The following shall be placed on each microcircuit:  
a. Index point (see 3.6.1).  
b. Part or identification number (PIN) (see 3.6.2).  
c. Certification mark "Q", or "QML" or “QD”: All Microcircuits acquired to, and meeting the requirements of this  
specification and the applicable SMD, device specification, or military temperature range data book parts, which are  
approved for supply under QML shall bear the "QML" or "Q" certification mark (see 3.6.3). For diminishing  
manufacturing sources (DMS) product using the alternate die/fabrication requirements of A.3.2.2 or other alternatives,  
the manufacturer shall use the “QD” certification mark in lieu of the “Q” or “QML” mark (see 3.6.3.1). The certification  
marks “Q", or "QML" or “QD” shall be visibly separate and distinct from all other markings on the microcircuits  
package.  
d. Manufacturer's identification (see 3.6.4).  
e. Country of origin (see 3.6.5).  
f. Date code (see 3.6.6).  
g. Special marking (see 3.6.7).  
h. Serialization; when specified by the procuring activity, each microcircuit shall be marked with a unique serial  
number assigned within that inspection lot prior to the first recorded electrical measurement in screening.  
i. Electrostatic discharge sensitivity identifier, if applicable (see 3.6.7.2).  
NOTE: For unpackaged die only items b. through i. shall apply and be marked on the wafer or die carrier and any other  
container external to the wafer or die carrier. For tape automated bonded (TAB) (see appendix F) device marking shall be as  
defined in the procurement document.  
3.6.1 Index point. The index point, tab, or other marking indicating the starting point for numbering of leads or for  
mechanical orientation shall be as specified in the device specification and shall be designed so that it is visible from above  
when the microcircuit is installed in its normal mounting configuration. The outline, or solid equilateral triangle(s), which are  
used as an electrostatic identifier (see 3.6.7.2), may also be used as the pin 1 identifier.  
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