MIL-PRF-38535K
APPENDIX A
A.4.5.5.1 Group D sample selection. Sample selection for group D shall be as follows:
a. The package types selected for group D inspection shall be either rotated among the package types
available at the time of sample selection from the allotted package family or worst case available from the
allotted package family. Worst case shall be determined by the manufacturer based on an incoming vendor
material control program (see A.4.5.5.2). For glass-sealed packages (e.g., cerdips, cerpacks), worst case is
based on the minimum seal area and the maximum cavity size (in most cases this shall be two packages).
Under the rotation option, if a package type has not been tested for 3 years, then the next assembled lot of
that package type shall receive group D inspection. If the manufacturer has a single package, which cannot
be grouped into a package family, the manufacturer has the option to perform the group D testing once per
calendar year on that package.
b. The product accepted for delivery shall be the inspection lot identification codes of the 36 successive weeks,
except as allowed in A.4.5.5.1a, beginning with the inspection lot identification code of the successful group
D sample for the package family.
c. Different device types may be used for different subgroups. Testing of a subgroup using a single device
type enclosed in the intended package type shall be considered as complying with the requirements for that
subgroup for all the device specifications or drawings utilizing the qualified package family and lead finish.
d. Technical justification shall be given for device selections for subgroups D-3 and D-4 in regards to device
technology electrical performance and package interaction. If a package and technology interaction is
present, subgroup D-3 and D-4 shall be performed on the affected combination separately or used as
coverage for the whole package family. Rotation of device technology is allowed to address this
requirement. For nonconformance see A.4.5.8.
A.4.5.5.2 Incoming vendor material control program. The manufacturer who utilizes the worst case group D option
shall have in place an incoming vendor material control program for the piece parts used in packaging (e.g., vendor
SPC program). The methods and procedures used to control inspection, storage, and handling of incoming materials
shall be documented.
A.4.5.6 Group E inspection. Group E inspection shall be in accordance with table C-I as specified herein or test
method 5005 of MIL-STD-883 and, at the contractor’s option, is allowed anytime following completion of wafer
fabrication. A device type which fails group E inspection may not be certified as an RHA microcircuit at the failed or
higher level, but may be used as a non-RHA microcircuit or certified at another (lower) level if the microcircuit meets
the lower level requirements and all other applicable requirements including pre- and post-irradiation electrical and
timing parametric limits.
A.4.5.6.1 Group E sample selection. Sample selection shall be in accordance with table C-I as specified herein or
test method 5005 of MIL-STD-883 and shall be from each wafer prior to assembly or from each inspection or wafer
lot. QCI requirements for class level B wafer lots shall be satisfied if all wafers used in that lot have been tested
individually in accordance with class level S requirements. For traceability, see A.3.4.6.
A.4.5.7 End-point tests for groups B, C, and D (and E if applicable) inspections. End-point measurements and
other specified post-test measurements shall be made for each microcircuit of the sample after completion of all other
specified tests in the subgroup. The test limits for the end-point measurements shall be the same as the test limits for
the respective group A subgroup inspections. Different end-points may be specified for group E tests in the device
specification or drawing. Any additional end-point electrical measurements that may be performed at the discretion of
the manufacturer, shall be accomplished in accordance with A.3.4.3 (e.g., tests performed on sample devices
subjected to groups B, C, and D (and E if applicable) tests shall be performed as a 100-percent screen on all
production devices represented by the sample) and shall be documented on the test travelers.
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ACTEL [ Actel Corporation ]
