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5962-0421901QUA 参数 Datasheet PDF下载

5962-0421901QUA图片预览
型号: 5962-0421901QUA
PDF下载: 下载PDF文件 查看货源
内容描述: [Field Programmable Gate Array, 250000 Gates, CMOS, CPGA624, CERAMIC, CGA-624]
分类和应用: 可编程逻辑
文件页数/大小: 217 页 / 1554 K
品牌: ACTEL [ Actel Corporation ]
 浏览型号5962-0421901QUA的Datasheet PDF文件第72页浏览型号5962-0421901QUA的Datasheet PDF文件第73页浏览型号5962-0421901QUA的Datasheet PDF文件第74页浏览型号5962-0421901QUA的Datasheet PDF文件第75页浏览型号5962-0421901QUA的Datasheet PDF文件第77页浏览型号5962-0421901QUA的Datasheet PDF文件第78页浏览型号5962-0421901QUA的Datasheet PDF文件第79页浏览型号5962-0421901QUA的Datasheet PDF文件第80页  
MIL-PRF-38535K  
APPENDIX A  
TABLE A-I. Testing guidelines for changes identified as major.  
Major changes  
Testing per group A, B, C, D, E herein or TM 5005 of  
MIL-STD-883 (All electrical parameters in accordance  
with the device specification or drawing 1/)  
a.  
b.  
c.  
d.  
Doping material source concentration  
Process technique  
Group A and C-1 deltas (variables only when deltas are  
required)  
Diffusion profile  
Group A and C-1 deltas (variables only when deltas are  
required)  
Die structure  
Group A and C-1 deltas (variables only when deltas are  
required)  
Mask changes affecting die size or  
active element  
Variable group A, C-1 prior to shipment, and notify the  
qualifying activity if new area is smaller/larger in  
applicable package than previously qualified.  
Wafer diameter  
Group A, C-1 prior to shipment  
Group D-3  
Final die thickness  
Passivation/glassivation  
e.  
Group A, C-1 and glass integrity test if current density is  
over 2 x 105  
f.  
g.  
h.  
i.  
Metallization changes  
Die attach method  
Group A, C-1, and B-5  
D-3 and D-4  
Die attach process  
D-3 and D-4  
Bond process  
B-5 and D-3  
j.  
Bond wire material/dimension  
Package or lid structure  
Package or lid material  
B-5 and D-3  
k.  
D-1 (variables), D-3, D-4, D-8 (lid torque) (variables)  
D-3, D-4, D-5, D-6 (variables), and D-8 (lid torque)  
(variables)  
Package or lid dimension  
Lead frame material  
Lead frame dimension  
Cavity dimension  
Sealing profile  
D-1 (variables), D-2, and D-8 (lid torque) (variables)  
See A.4.4.2.7  
D-1 (variables) and D-2  
B-5, D-2, D-6 (variables), and D-8 (lid torque) (variables)  
D-3, D-4, D-6 (variables), and D-8 (lid torque) (variables)  
D-3, D-4, D-6 (variables), and D-8 (lid torque) (variables)  
l.  
Sealing material  
Frame attach  
B-3, D-3, D-4, D-6 (variables), and D-7 (adhesion of lead  
finish) (variables)  
Frame cleaning  
B-3, D-2, D-3, and D-7 (adhesion of lead finish)  
62  
 
 
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