MIL-PRF-38535K
APPENDIX A
TABLE A-I. Testing guidelines for changes identified as major.
Major changes
Testing per group A, B, C, D, E herein or TM 5005 of
MIL-STD-883 (All electrical parameters in accordance
with the device specification or drawing 1/)
a.
b.
c.
d.
Doping material source concentration
Process technique
Group A and C-1 deltas (variables only when deltas are
required)
Diffusion profile
Group A and C-1 deltas (variables only when deltas are
required)
Die structure
Group A and C-1 deltas (variables only when deltas are
required)
Mask changes affecting die size or
active element
Variable group A, C-1 prior to shipment, and notify the
qualifying activity if new area is smaller/larger in
applicable package than previously qualified.
Wafer diameter
Group A, C-1 prior to shipment
Group D-3
Final die thickness
Passivation/glassivation
e.
Group A, C-1 and glass integrity test if current density is
over 2 x 105
f.
g.
h.
i.
Metallization changes
Die attach method
Group A, C-1, and B-5
D-3 and D-4
Die attach process
D-3 and D-4
Bond process
B-5 and D-3
j.
Bond wire material/dimension
Package or lid structure
Package or lid material
B-5 and D-3
k.
D-1 (variables), D-3, D-4, D-8 (lid torque) (variables)
D-3, D-4, D-5, D-6 (variables), and D-8 (lid torque)
(variables)
Package or lid dimension
Lead frame material
Lead frame dimension
Cavity dimension
Sealing profile
D-1 (variables), D-2, and D-8 (lid torque) (variables)
See A.4.4.2.7
D-1 (variables) and D-2
B-5, D-2, D-6 (variables), and D-8 (lid torque) (variables)
D-3, D-4, D-6 (variables), and D-8 (lid torque) (variables)
D-3, D-4, D-6 (variables), and D-8 (lid torque) (variables)
l.
Sealing material
Frame attach
B-3, D-3, D-4, D-6 (variables), and D-7 (adhesion of lead
finish) (variables)
Frame cleaning
B-3, D-2, D-3, and D-7 (adhesion of lead finish)
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ACTEL [ Actel Corporation ]
