MIL-PRF-38535K
TABLE V. Group D tests (Package related test) . - Continued.
7/ For devices with solder terminations, subgroups 3 and 4 tests may be performed without balls and columns.
8/ Lead bend stress initial conditioning is not required for leadless chip carrier packages or BGA/CGA packages. For fine pitch
packages ( ≤ 25 mil pitch) using a nonconductive tie bar, preconditioning shall be required on 3 devices only prior to the moisture
resistance test with no subsequent electrical test required on these 3 devices. The remaining 12 devices from the sample of 15
devices do not require preconditioning but shall be subjected to the required endpoint electrical tests.
9/ After completion of the required visual examinations and prior to submittal to TM 1014 seal tests, the devices may have the
corrosion by-products removed by using a bristle brush.
10/ At the manufacturer's option, end-point electrical parameters may be performed after moisture resistance and prior to seal test.
11/ For flip chip packages Constant acceleration test is not required.
12/ Test three devices; if one fails, test two additional devices with no failures. At the manufacturer's option, if the initial test sample
(e.g., 3 or 5 devices) fails a second complete sample may be tested at an alternate laboratory that has been issued suitability by
the qualifying activity. If this sample passes the lot shall be accepted provided the devices and data from both submissions is
submitted to the qualifying activity along with 5 additional devices from the same lot. If sample size (accept number) of 5(1) is
used to pass the lot, the manufacturer shall evaluate his product to determine the reason for the failure and whether the lot is at
risk.
13/ The adhesion of lead finish test shall not apply for leadless chip carrier, land grid array (LGA), ball grid array (BGA), and column
grid array (CGA) packages.
14/ Sample size number 15 leads from 3 devices minimum are based on number of leads with zero failure.
15/ Lid torque test shall apply only to packages which use a glass-frit-seal to lead frame, lead or package body (e.g., wherever frit
seal establishes hermeticity or package integrity). Device packages with lid/heat sink attached on the back side of a flip chip die
require a lid shear or lid torque test. Manufacturers shall submit test procedures for lid shear test for approval of QA. Lid torque
test shall be performed in accordance with TM 2024.
16/ This test is performed at qualification/re-qualification of design changes which may affect this test. The manufacturer shall
determine, for each package, the applicable conditions from TM 2036 that are appropriate for the mounting conditions, and
assure by testing, or through their assembly processes, that the part is subjected to an equivalent time/temperature stress.
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ACTEL [ Actel Corporation ]
