MIL-PRF-38535K
TABLE V. Group D tests (Package related test) .
MIL-STD-883 test method and conditions
Class V
Subgroups test
Tests 1/
Class Q
Class Y
(class level B)
(class level S)
(class level S)
Subgroup 1
sample size 15(0)
2/
Physical dimensions
TM 2016
TM 2016
TM 2016
Where applicable
a. TM 2004
Where applicable
a. TM 2004
Where applicable
a. TM 2004
Subgroup 2
sample size 45(0)
2/ 3/
a. Lead/terminal integrity
test
condition B2 (lead fatigue) condition B2 (lead fatigue) condition B2 (lead fatigue)
or applicable for the
or applicable for the
or applicable for the
package technology style
package technology style
package technology style
b. Seal test 4/
(1) Fine leak
b. TM 1014
Test condition as
applicable
b. TM 1014
Test condition as
applicable
b. 5/
(2) Gross leak
c. For BGA/CGA packages
c. BGA/CGA packages
c. BGA/CGA packages
c. BGA/CGA packages
(i) Ball shear test for BGA
package
(i) For BGA package -
JESD22-B117
(i) For BGA package -
JESD22-B117
(i) For BGA package -
JESD22-B117
(45 balls from 2 devices
minimum)
(45 balls from 2 devices
minimum)
(45 balls from 2 devices
minimum)
(ii) Solder column pull test
for CGA package
(ii) For CGA package -
TM 2038
(ii) For CGA package -
TM 2038
(ii) For CGA package -
TM 2038
(45 columns from
2 devices minimum)
(45 columns from
2 devices minimum)
(45 columns from 2 devices
minimum)
Subgroup 3
sample size 15(0)
6/ 7/
a. Thermal shock
a. TM 1011
a. TM 1011
a. TM 1011
Test condition B,
15 cycles minimum
Test condition B,
15 cycles minimum
Test condition B,
15 cycles minimum
b. Temperature cycling
b. TM 1010
b. TM 1010
b. TM 1010
Test condition C,
100 cycles minimum
Test condition C,
100 cycles minimum
Test condition C,
100 cycles minimum
c. Moisture resistance
d. Visual examination
c. TM 1004 8/
c. TM 1004 8/
c. HAST in accordance with
JESD22-A118,
condition B
d. In accordance with
visual criteria of
d. In accordance with
visual criteria of
d. In accordance with visual
criteria of TM 1004 or
TM 1010
TM 1004 or TM 1010
TM 1004 or TM 1010
e. Seal test 9/
(1) Fine leak
e. TM 1014 test condition e. TM 1014 test condition e. 5/
as applicable
as applicable
(2) Gross leak
f. End-point electrical
parameters 10/
f. As specified in the
applicable device
f. As specified in the
applicable device
f. As specified in the
applicable device
.
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ACTEL [ Actel Corporation ]
