MIL-PRF-38535K
6.4.12 Acquiring activity. The organizational element which contracts for articles, supplies, or services; or it may be a
contractor or subcontractor when the organizational element has given specific written authorization to such contractor or
subcontractor to serve as agent of the acquiring activity. A contractor or subcontractor serving as agent of the acquiring
activity does not have the authority to grant waivers, deviations, or exceptions to this specification unless specific written
authorization to do so has been given by the organization (e.g., preparing activity, qualifying activity).
6.4.13 Qualifying activity (QA). The organizational element of the Government that grants certification and qualification for
the specific technology flow in accordance with this specification.
6.4.14 Parts per million (PPM). Parts per million is as defined in EIA-557.
6.4.15 Device type. The term device type refers to a single specific microcircuit configuration.
6.4.16 Die type. A microcircuit manufactured using the same physical size, materials, topology, mask set, process flow, on
a single fabrication line.
6.4.17 Radiation hardness assurance (RHA). The portion of product assurance that assures that parts continue to perform
as specified or degrade in a specified manner when subjected to the specified radiation environmental stress. The radiation
hardness assurance capability level (RHACL) is the radiation level that the manufacturer chooses for each radiation
environment appropriate to his technology as a consistently achievable exposure level that does not cause degradation in the
microcircuit beyond the specified level of performance.
6.4.18 Electrostatic discharge (ESD) sensitivity . ESD sensitivity is defined as the level of susceptibility of a device to
damage by static electricity. The level of susceptibility of a device is found by ESD classification testing and is used as the
basis for assigning an ESD class.
6.4.19 Package family. A group of package types with identical configuration and process techniques (e.g., cerdip, side
braze, cerpack).
6.4.20 Technology flow. A technology flow is that specific manufacturing line from design, fabrication, assembly,
packaging, and test in a given technology from which a manufacturer designs, builds, and tests integrated circuits. Once a
manufacturer's technology flow has been certified and qualified by the QA, it is listed on the QML.
6.4.21 Qualified Manufacturer's Listing (QML). The QML is a listing of the manufacturers and their parts which utilize a
certified and qualified technology flow.
6.4.22 Third party design center. A subcontract design center, or an original equipment manufacturer (OEM) design center,
that uses a microcircuit manufacturer's design tools (including approved industry/third party tools), interface procedures,
design rules, and design controls.
6.4.23 Radiation source of supply (RSS). A company (e.g., original equipment manufacturer (OEM)) who establishes a
relationship with a device manufacturer for the sole purpose of developing qualified RHA product and has the responsibility to
incur the radiation response of said product to the requirements of MIL-PRF-38535, the applicable detail specification, and the
RSS program plan. The RSS will be listed in the QML for those devices covered by the RSS's QML. All requests for this
product will be submitted through the RSS.
6.4.24 Form. The shape, size, dimension, mass, weight, and other visual parameters which uniquely characterize an item.
For software, form denotes the language and media.
6.4.25 Fit. The ability of an item to physically interface, or interconnect with, or become an integral part of another item.
6.4.26 Function. The action or actions that an item is designed to perform.
36
ACTEL [ Actel Corporation ]
