MIL-PRF-38535K
CONTENTS
PARAGRAPH
PAGE
J.3.11 In-line TCI testing (option 2)...........................................................................................................................184
J.3.11.1 Group A electrical testing ............................................................................................................................185
J.3.11.2 Group C life tests.........................................................................................................................................185
J.3.12 Test optimization requirements ......................................................................................................................185
INDEX........................................................................................................................................................................187
FIGURES
FIGURE 1. The QML manufacturing line ....................................................................................................................40
FIGURE 2. Combinations of a manufacturing line.......................................................................................................40
FIGURE F-1. Lead contact length.............................................................................................................................136
FIGURE G-1. Generic qualification flow diagram......................................................................................................139
TABLES
TABLE IA. Screening procedure for hermetic classes Q, V and non-hermetic class Y microcircuits..........................18
TABLE IA. Screening procedure for hermetic classes Q, V and non-hermetic class Y microcircuits..........................19
TABLE IA. Screening procedure for hermetic classes Q, V and non-hermetic class Y microcircuits..........................20
TABLE IA. Screening procedure for hermetic classes Q, V and non-hermetic class Y microcircuits..........................21
TABLE IA. Screening procedure for hermetic classes Q, V and non-hermetic class Y microcircuits..........................22
TABLE IB. Tests/monitors for plastic packages ..........................................................................................................23
TABLE II. Group B tests (Mechanical and environmental test) ...................................................................................24
TABLE II. Group B tests (Mechanical and environmental test) ...................................................................................25
TABLE II. Group B tests (Mechanical and environmental test) ...................................................................................26
TABLE II. Group B tests (Mechanical and environmental test) ...................................................................................27
TABLE III. Group A (electrical tests) ...........................................................................................................................28
TABLE IV. Group C life tests.......................................................................................................................................29
TABLE V. Group D tests (Package related test) .........................................................................................................30
TABLE V. Group D tests (Package related test) .........................................................................................................31
TABLE V. Group D tests (Package related test) .........................................................................................................32
TABLE V. Group D tests (Package related test) .........................................................................................................33
TABLE A-I. Testing guidelines for changes identified as major...................................................................................62
TABLE A-I. Testing guidelines for changes identified as major...................................................................................63
FIGURE A-1. Solder dipping area when seating plane is not defined.........................................................................66
TABLE A-II. Lead finish systems.................................................................................................................................67
TABLE A-III. Coating thickness and composition requirements..................................................................................68
TABLE A-IV. Package element (other than leads/terminals) finish systems ...............................................................69
TABLE A-V. Lead finish ..............................................................................................................................................71
TABLE A-VI. Digital microcircuits................................................................................................................................82
TABLE A-VII. Linear microcircuits...............................................................................................................................83
TABLE A-VIII. Other microcircuits...............................................................................................................................83
TABLE A-IX. Application specific microcircuits............................................................................................................83
TABLE A-X. Quality assurance program requirements...............................................................................................90
TABLE C-I. Group E (RHA) TCI/QCI test for class Q, class V and class Y...............................................................116
TABLE C-I. Group E (RHA) TCI/QCI test for class Q, class V and class Y...............................................................117
TABLE C-I. Group E (RHA) TCI/QCI test for class Q, class V and class Y...............................................................118
TABLE D-I. Sample size series (SSS) sampling plan ...............................................................................................123
TABLE D-II. Hypergeometric sampling plans for small lot sizes of 200 or less.........................................................124
TABLE D-II. Hypergeometric sampling plans for small homogenous lot sizes of 200 or less ...................................125
TABLE H-IA. Assembly process technology testing for hermetic and non-hermetic packages.................................172
TABLE H-IB. Assembly process technology testing for plastic packages .................................................................173
TABLE H-IIA. Technology characterization testing for hermetic and non-hermetic packages ..................................174
TABLE H-IIB. Technology characterization testing for plastic packages...................................................................175
TABLE J-I. End-of-line TCI testing procedure (option 1)...........................................................................................185
xiv
ACTEL [ Actel Corporation ]
