MIL-PRF-38535K
CONTENTS
PARAGRAPH
PAGE
G.3.2.1 Organizational structure ...............................................................................................................................138
G.3.2.2 TRB duties....................................................................................................................................................138
G.3.2.2.1 QML certification and qualification test plan (see G.3.3g) .........................................................................140
G.3.2.3 Status report.................................................................................................................................................140
G.3.3 QM plan...........................................................................................................................................................141
G.3.3.1 QM plan outline ............................................................................................................................................141
G.3.4 Change control procedures.............................................................................................................................143
G.3.4.1 Design methodology change........................................................................................................................144
G.3.4.2 Fabrication process change .........................................................................................................................144
G.3.4.3 Assembly process change............................................................................................................................145
G.3.4.4 Package change...........................................................................................................................................146
G.3.4.5 Test facility change.......................................................................................................................................146
H.1 SCOPE...............................................................................................................................................................148
H.1.1 Scope ..............................................................................................................................................................148
H.2 APPLICABLE DOCUMENTS..............................................................................................................................148
H.2.1 General............................................................................................................................................................148
H.2.2 Government documents ..................................................................................................................................148
H.2.2.1 Specifications, standards, and handbooks ...................................................................................................148
H.2.3 Non-Government publications .........................................................................................................................149
H.2.4 Order of precedence........................................................................................................................................149
H.3 REQUIREMENTS...............................................................................................................................................150
H.3.1 General............................................................................................................................................................150
H.3.1.1 Characterization requirements......................................................................................................................150
H.3.1.2 Certification...................................................................................................................................................150
H.3.1.3 Validation......................................................................................................................................................150
H.3.1.4 Transitional certification................................................................................................................................150
H.3.1.5 Qualification requirements............................................................................................................................150
H.3.1.6 New technology requirements ......................................................................................................................150
H.3.1.7 Mature technology requirements ..................................................................................................................150
H.3.1.8 General QML process flows .........................................................................................................................150
H.3.1.9 Overview of QML Approval Process.............................................................................................................153
H.3.1.10 Manufacturer’s Responsibility.....................................................................................................................154
H.3.1.11 Qualifying Activity (QA) Responsibility........................................................................................................154
H.3.2 Certification......................................................................................................................................................154
H.3.2.1 Design, Wafer Fabrication, Assembly, and Test Certification.......................................................................154
H.3.2.1.1 Design .......................................................................................................................................................154
H.3.2.1.1.1 Circuit design..........................................................................................................................................154
H.3.2.1.1.2 Design checklist (Class level S)..............................................................................................................155
H.3.2.1.1.3 Package Design .....................................................................................................................................156
H.3.2.1.2 Wafer fabrication .......................................................................................................................................157
H.3.2.1.2.1 Wafer fabrication checklist (Class level S)..............................................................................................157
H.3.2.1.3 SPC and in-process monitoring program...................................................................................................158
H.3.2.1.3.1 SPC and in-process monitoring checklist (Class level S) .......................................................................159
H.3.2.1.3.2 Parametric monitor .................................................................................................................................160
H.3.2.1.4 Wafer acceptance plan..............................................................................................................................162
H.3.2.1.5 Assembly and packaging...........................................................................................................................163
H.3.2.1.5 Assembly and packaging technology certification .....................................................................................163
H.3.2.1.6 SPC and in-process monitoring program...................................................................................................164
H.3.2.1.7 Test capability............................................................................................................................................164
H.3.2.1.7 Certification approval.................................................................................................................................164
H.3.2.2 Physics-of-failure/TCV reliability assessment...............................................................................................164
H.3.2.2.1 Reliability assessment plan .......................................................................................................................164
H.3.2.2.2 TCV program.............................................................................................................................................164
H.3.2.2.2.1 TCV certification .....................................................................................................................................165
H.3.2.2.3 Assembly and packaging...........................................................................................................................166
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ACTEL [ Actel Corporation ]
