MIL-PRF-38535K
CONTENTS
PARAGRAPH
PAGE
H.3.2.2.3.1 Assembly process technology ................................................................................................................166
H.3.2.2.3.2 Packaging technology.............................................................................................................................166
H.3.2.2.4 Reliability assessment report.....................................................................................................................167
H.3.3 Transitional certification...................................................................................................................................167
H.3.3.1 Transitional certification and qualification.....................................................................................................167
H.3.4 Qualification.....................................................................................................................................................168
H.3.4.1 Technology qualification...............................................................................................................................168
H.3.4.1.1 Process technology validation ...................................................................................................................169
H.3.4.1.2 Technology qualification eligibility..............................................................................................................169
H.3.4.1.3 Demonstration vehicles .............................................................................................................................169
H.3.4.2 Technology qualification test plan.................................................................................................................169
H.3.4.3 Wafer fabrication technology validation........................................................................................................170
H.3.4.4 Assembly/Packaging technology validation..................................................................................................170
H.3.4.4.1 Package integrity demonstration test plan (PIDTP)...................................................................................171
H.3.4.4.1.1 Non-Hermetic packages .........................................................................................................................171
H.3.4.4.1.2 Flip-chip assembly..................................................................................................................................171
H.3.4.4.1.3 Solder terminations.................................................................................................................................171
H.3.4.5 Technology qualification report approval......................................................................................................176
H.3.4.6 Qualification test report.................................................................................................................................176
H.3.4.7 Qualification test failures...............................................................................................................................176
H.3.4.8 Product qualification (extension from existing qualified technology).............................................................177
H.3.5 Standard microcircuit drawings........................................................................................................................178
H.3.6 Listing of microcircuits on the Qualified Manufacturer’s List (QML).................................................................178
J.1 SCOPE................................................................................................................................................................180
J.1.1 Scope...............................................................................................................................................................180
J.2 APPLICABLE DOCUMENTS ..............................................................................................................................180
J.2.1 General.............................................................................................................................................................180
J.2.2 Government documents...................................................................................................................................180
J.2.2.1 Specifications, standards, and handbooks....................................................................................................180
J.2.3 Non-Government publications..........................................................................................................................180
J.2.4 Order of precedence ........................................................................................................................................180
J.3 TCI AND SCREENING INFORMATION..............................................................................................................181
J.3.1 Mask requirements (when applicable)..............................................................................................................181
J.3.1.1 Wafer fabrication process..............................................................................................................................181
J.3.2 Assembly process procedures .........................................................................................................................181
J.3.2.1 Assembly rework requirements .....................................................................................................................181
J.3.3 Internal visual inspection..................................................................................................................................181
J.3.4 Constant acceleration.......................................................................................................................................182
J.3.5 Burn-in..............................................................................................................................................................182
J.3.6 Final electrical measurements..........................................................................................................................182
J.3.7 Seal (fine and gross leak) testing .....................................................................................................................182
J.3.8 Pattern failures .................................................................................................................................................182
J.3.8.1 Pattern failure rejects ....................................................................................................................................182
J.3.9 TCI ...................................................................................................................................................................182
J.3.9.1 General..........................................................................................................................................................183
J.3.9.2 TCI reporting .................................................................................................................................................183
J.3.9.3 Technology conformance inspection of multi-product wafer lots ...................................................................183
J.3.10 End-of-line TCI (option 1) ...............................................................................................................................183
J.3.10.1 Group A inspection......................................................................................................................................184
J.3.10.2 Group B inspection......................................................................................................................................184
J.3.10.3 Group C inspection......................................................................................................................................184
J.3.10.4 Group D inspection......................................................................................................................................184
J.3.10.5 Group E inspection......................................................................................................................................184
J.3.10.6 End-point tests for groups C, D, (E if applicable).........................................................................................184
J.3.10.7 End-of-line TCI testing (option 1).................................................................................................................184
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ACTEL [ Actel Corporation ]
