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5962-0421901QUA 参数 Datasheet PDF下载

5962-0421901QUA图片预览
型号: 5962-0421901QUA
PDF下载: 下载PDF文件 查看货源
内容描述: [Field Programmable Gate Array, 250000 Gates, CMOS, CPGA624, CERAMIC, CGA-624]
分类和应用: 可编程逻辑
文件页数/大小: 217 页 / 1554 K
品牌: ACTEL [ Actel Corporation ]
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MIL-PRF-38535K  
CONTENTS  
PARAGRAPH  
PAGE  
H.3.2.2.3.1 Assembly process technology ................................................................................................................166  
H.3.2.2.3.2 Packaging technology.............................................................................................................................166  
H.3.2.2.4 Reliability assessment report.....................................................................................................................167  
H.3.3 Transitional certification...................................................................................................................................167  
H.3.3.1 Transitional certification and qualification.....................................................................................................167  
H.3.4 Qualification.....................................................................................................................................................168  
H.3.4.1 Technology qualification...............................................................................................................................168  
H.3.4.1.1 Process technology validation ...................................................................................................................169  
H.3.4.1.2 Technology qualification eligibility..............................................................................................................169  
H.3.4.1.3 Demonstration vehicles .............................................................................................................................169  
H.3.4.2 Technology qualification test plan.................................................................................................................169  
H.3.4.3 Wafer fabrication technology validation........................................................................................................170  
H.3.4.4 Assembly/Packaging technology validation..................................................................................................170  
H.3.4.4.1 Package integrity demonstration test plan (PIDTP)...................................................................................171  
H.3.4.4.1.1 Non-Hermetic packages .........................................................................................................................171  
H.3.4.4.1.2 Flip-chip assembly..................................................................................................................................171  
H.3.4.4.1.3 Solder terminations.................................................................................................................................171  
H.3.4.5 Technology qualification report approval......................................................................................................176  
H.3.4.6 Qualification test report.................................................................................................................................176  
H.3.4.7 Qualification test failures...............................................................................................................................176  
H.3.4.8 Product qualification (extension from existing qualified technology).............................................................177  
H.3.5 Standard microcircuit drawings........................................................................................................................178  
H.3.6 Listing of microcircuits on the Qualified Manufacturer’s List (QML).................................................................178  
J.1 SCOPE................................................................................................................................................................180  
J.1.1 Scope...............................................................................................................................................................180  
J.2 APPLICABLE DOCUMENTS ..............................................................................................................................180  
J.2.1 General.............................................................................................................................................................180  
J.2.2 Government documents...................................................................................................................................180  
J.2.2.1 Specifications, standards, and handbooks....................................................................................................180  
J.2.3 Non-Government publications..........................................................................................................................180  
J.2.4 Order of precedence ........................................................................................................................................180  
J.3 TCI AND SCREENING INFORMATION..............................................................................................................181  
J.3.1 Mask requirements (when applicable)..............................................................................................................181  
J.3.1.1 Wafer fabrication process..............................................................................................................................181  
J.3.2 Assembly process procedures .........................................................................................................................181  
J.3.2.1 Assembly rework requirements .....................................................................................................................181  
J.3.3 Internal visual inspection..................................................................................................................................181  
J.3.4 Constant acceleration.......................................................................................................................................182  
J.3.5 Burn-in..............................................................................................................................................................182  
J.3.6 Final electrical measurements..........................................................................................................................182  
J.3.7 Seal (fine and gross leak) testing .....................................................................................................................182  
J.3.8 Pattern failures .................................................................................................................................................182  
J.3.8.1 Pattern failure rejects ....................................................................................................................................182  
J.3.9 TCI ...................................................................................................................................................................182  
J.3.9.1 General..........................................................................................................................................................183  
J.3.9.2 TCI reporting .................................................................................................................................................183  
J.3.9.3 Technology conformance inspection of multi-product wafer lots ...................................................................183  
J.3.10 End-of-line TCI (option 1) ...............................................................................................................................183  
J.3.10.1 Group A inspection......................................................................................................................................184  
J.3.10.2 Group B inspection......................................................................................................................................184  
J.3.10.3 Group C inspection......................................................................................................................................184  
J.3.10.4 Group D inspection......................................................................................................................................184  
J.3.10.5 Group E inspection......................................................................................................................................184  
J.3.10.6 End-point tests for groups C, D, (E if applicable).........................................................................................184  
J.3.10.7 End-of-line TCI testing (option 1).................................................................................................................184  
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