LX1992
High Efficiency LED Driver
L I N F I N I T Y D I V I S I O N
PRODUCTION
PACKAGE DIMENSIONS
8-Pin Miniature Shrink Outline Package (MSOP)
DU
A
MILLIMETERS
INCHES
Dim
MIN
2.85
2.90
–
MAX
3.05
3.10
1.10
0.40
MIN
.112
.114
–
MAX
.120
A
B
C
.122
0.043
0.160
B
D
0.25
0.009
G
H
J
0.65 BSC
0.025 BSC
0.38
0.13
0.64
0.18
0.015
0.005
0.025
0.007
H
G
K
0.95 BSC
0.037 BSC
P
L
M
N
P
0.40
0.70
0.016
0.027
M
3°
3°
C
0.05
4.75
0.15
5.05
0.002
0.187
0.006
0.198
K
N
L
D
8-Pin Plastic MLP-Micro Exposed Pad
LM
MILLIMETERS
INCHES
Dim
MIN
0.80
0.00
0.65
0.15
0.28
2.90
2.90
MAX
1.00
0.05
0.75
0.25
0.38
3.10
3.10
MIN
MAX
0.039
0.002
0.029
0.009
0.015
0.122
0.122
A
A1
A2
A3
b
0.031
0.000
0.025
0.005
0.011
0.114
0.114
L
D
L2
K
D
D2
E
E
e
0.65 BSC
0.025 BSC
E2
D2
E2
K
1.52
1.02
0.20
0.20
0
2.08
1.31
*
0.060
0.040
0.008
0.008
0
0.082
0.052
*
e
b
L2
A
Θ
L
0.60
0.13
12°
0.023
0.005
12°
A2
Internally Connected
together, but isolated
L2
Θ
0°
0°
from all other terminals
A1
A3
Note:
1. Dimensions do not include mold flash or
protrusions;
these
shall
not
exceed
0.155mm(.006”) on any side. Lead dimension
shall not include solder coverage.
Copyright 2000
Microsemi
Page 10
Rev. 1.1, 2002-11-21
Linfinity Microelectronics Division
11861 Western Avenue, Garden Grove, CA. 92841, 714-898-8121, Fax: 714-893-2570
ETC [ ETC ]
