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LH28F800BVE-TV85 参数 Datasheet PDF下载

LH28F800BVE-TV85图片预览
型号: LH28F800BVE-TV85
PDF下载: 下载PDF文件 查看货源
内容描述: X8 / X16闪存EEPROM [x8/x16 Flash EEPROM ]
分类和应用: 闪存内存集成电路光电二极管可编程只读存储器电动程控只读存储器电可擦编程只读存储器
文件页数/大小: 48 页 / 549 K
品牌: ETC [ ETC ]
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LHF80V25  
20  
sharp  
5 DESIGN CONSIDERATIONS  
5.1 Three-Line Output Control  
5.3 Power Supply Decoupling  
Flash memory power switching characteristics require  
careful device decoupling. System designers are interested  
in three supply current issues; standby current levels,  
active current levels and transient peaks produced by  
falling and rising edges of CE# and OE#. Transient current  
magnitudes depend on the device outputs’ capacitive and  
inductive loading. Two-line control and proper decoupling  
capacitor selection will suppress transient voltage peaks.  
Each device should have a 0.1µF ceramic capacitor  
connected between its V and GND and between its V  
The device will often be used in large memory arrays.  
SHARP provides three control inputs to accommodate  
multiple memory connections. Three-line control provides  
for:  
a. Lowest possible memory power dissipation.  
b. Complete assurance that data bus contention will not  
occur.  
CC  
PP  
and GND. These high-frequency, low inductance  
capacitors should be placed as close as possible to package  
leads. Additionally, for every eight devices, a 4.7µF  
electrolytic capacitor should be placed at the array’s power  
To use these control inputs efficiently, an address decoder  
should enable CE# while OE# should be connected to all  
memory devices and the system’s READ# control line.  
This assures that only selected memory devices have  
active outputs while deselected memory devices are in  
standby mode. RP# should be connected to the system  
POWERGOOD signal to prevent unintended writes during  
system power transitions. POWERGOOD should also  
toggle during system reset.  
supply connection between V  
and GND. The bulk  
CC  
capacitor will overcome voltage slumps caused by PC  
board trace inductance.  
5.4 V Trace on Printed Circuit Boards  
PP  
Updating flash memories that reside in the target system  
requires that the printed circuit board designer pay  
attention to the V Power supply trace. The V pin  
5.2 RY/BY#, Block Erase and Word/Byte  
Write Polling  
PP  
PP  
supplies the memory cell current for word/byte writing  
and block erasing. Use similar trace widths and layout  
considerations given to the V power bus. Adequate V  
RY/BY# is an open drain output that should be connected  
CC  
PP  
to V by a pull up resistor to provide a hardware method  
CC  
supply traces and decoupling will decrease V voltage  
PP  
of detecting block erase and word/byte write completion.  
It transitions low after block erase or word/byte write  
commands and returns to High Z when the WSM has  
finished executing the internal algorithm.  
spikes and overshoots.  
RY/BY# can be connected to an interrupt input of the  
system CPU or controller. It is active at all times. RY/BY#  
is also High Z when the device is in block erase suspend  
(with word/byte write inactive), word/byte write suspend  
or deep power-down modes.  
Rev. 1.2  
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