Solder Reflow Temperature Profile
300
PREHEATING RATE 3°C + 1°C/–0.5°C/SEC.
REFLOW HEATING RATE 2.5°C ± 0.5°C/SEC.
PEAK
TEMP.
245°C
PEAK
TEMP.
240°C
PEAK
TEMP.
230°C
200
100
0
2.5 C ± 0.5 C/SEC.
SOLDERING
TIME
200°C
30
160 C
150 C
140 C
SEC.
30
SEC.
3 C + 1 C/–0.5 C
PREHEATING TIME
150 C, 90 + 30 SEC.
50 SEC.
TIGHT
TYPICAL
LOOSE
ROOM
TEMPERATURE
0
50
100
150
200
250
TIME (SECONDS)
Note: Non-halide flux should be used.
Recommended PB-Free IR Profile
TIME WITHIN 5 C of ACTUAL
PEAK TEMPERATURE
t
p
20-40 SEC.
260 +0/-5 C
T
T
p
217 C
L
RAMP-UP
3 C/SEC. MAX.
150 - 200 C
RAMP-DOWN
6 C/SEC. MAX.
T
smax
T
smin
t
s
t
L
60 to 150 SEC.
PREHEAT
60 to 180 SEC.
25
t 25 C to PEAK
TIME
NOTES:
THE TIME FROM 25 C to PEAK TEMPERATURE = 8 MINUTES MAX.
= 200 C, T = 150 C
T
smax
smin
Note: Non-halide flux should be used.
5
ETC [ ETC ]
