Le7920
Data Sheet
OPERATING RANGES
The operating ranges define those limits between which the functionality of the device is guaranteed.
Commercial (C) Devices
Ambient temperature .............................0°C to +70°C*
V
..................................................... 4.75 V to 5.25 V
CC
V
..................................................... –19 V to –58 V
BAT
AGND/DGND ..........................................................0 V
BGND with respect to
AGND/DGND ....................... –100 mV to +100 mV
Load resistance on VTX to ground ..............20 kΩ min
* Zarlink guarantees the performance of this device over commercial (0 to 70º C) and industrial (-40 to 85ºC) temperature ranges
by conducting electrical characterization over each range and by conducting a production test with single insertion coupled to
periodic sampling. These characterization and test procedures comply with section 4.6.2 of Bellcore GR-357-CORE Component
Reliability Assurance Requirements for Telecommunications Equipment.
Package Assembly
The standard (non-green) package devices are assembled with industry-standard mold compounds, and the leads possess a tin/
lead (Sn/Pb) plating. These packages are compatible with conventional SnPb eutectic solder board assembly processes. The
peak soldering temperature should not exceed 225°C during printed circuit board assembly.
The green package devices are assembled with enhanced environmental compatible lead (Pb), halogen, and antimony-free
materials. The leads possess a matte-tin plating which is compatible with conventional board assembly processes or newer lead-
free board assembly processes. The peak soldering temperature should not exceed 245°C during printed circuit board assembly.
Refer to IPC/JEDEC J-Std-020B Table 5-2 for the recommended solder reflow temperature profile
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Zarlink Semiconductor Inc.
ZARLINK [ ZARLINK SEMICONDUCTOR INC ]
