R
Platform Flash In-System Programmable Configuration PROMS
CLK
CE
OE/RESET
TCK
TMS
TDI
TDO
Control
and
JTAG
Interface
Data
Memory
Address
Data
Serial
Interface
CEO
DATA (D0)
Serial Mode
CF
ds123_01_30603
Figure 1:
XCFxxS Platform Flash PROM Block Diagram
FI
CLK
CE
EN_EXT_SEL
OE/RESET
BUSY
CLKOUT
TCK
TMS
TDI
TDO
Control
and
JTAG
Interface
OSC
Data
Address
Memory
Data
Serial
or
Parallel
Interface
CEO
DATA (D0)
(Serial/Parallel Mode)
D[1:7]
(Parallel Mode)
Decompressor
CF
REV_SEL [1:0]
ds123_19_050604
Figure 2:
XCFxxP Platform Flash PROM Block Diagram
When the FPGA is in Master Serial mode, it generates a
configuration clock that drives the PROM. With CF High, a
short access time after CE and OE are enabled, data is
available on the PROM DATA (D0) pin that is connected to
the FPGA DIN pin. New data is available a short access
time after each rising clock edge. The FPGA generates the
appropriate number of clock pulses to complete the config-
uration.
When the FPGA is in Slave Serial mode, the PROM and the
FPGA are both clocked by an external clock source, or
optionally, for the XCFxxP PROM only, the PROM can be
used to drive the FPGA’s configuration clock.
The XCFxxP version of the Platform Flash PROM also sup-
ports Master SelectMAP and Slave SelectMAP (or Slave
Parallel) FPGA configuration modes. When the FPGA is in
Master SelectMAP mode, the FPGA generates a configura-
tion clock that drives the PROM. When the FPGA is in Slave
SelectMAP Mode, either an external oscillator generates
the configuration clock that drives the PROM and the
FPGA, or optionally, the XCFxxP PROM can be used to
drive the FPGA’s configuration clock. With BUSY Low and
CF High, after CE and OE are enabled, data is available on
the PROMs DATA (D0-D7) pins. New data is available a
short access time after each rising clock edge. The data is
clocked into the FPGA on the following rising edge of the
CCLK. A free-running oscillator can be used in the Slave
Parallel /Slave SelecMAP mode.
The XCFxxP version of the Platform Flash PROM provides
additional advanced features. A built-in data decompressor
supports utilizing compressed PROM files, and design revi-
sioning allows multiple design revisions to be stored on a
single PROM or stored across several PROMs. For design
revisioning, external pins or internal control bits are used to
select the active design revision.
Multiple Platform Flash PROM devices can be cascaded to
support the larger configuration files required when target-
ing larger FPGA devices or targeting multiple FPGAs daisy
chained together. When utilizing the advanced features for
the XCFxxP Platform Flash PROM, such as design revi-
sioning, programming files which span cascaded PROM
devices can only be created for cascaded chains containing
only XCFxxP PROMs. If the advanced XCFxxP features are
DS123 (v2.6) March 14, 2005
Preliminary Product Specification
2
XILINX [ XILINX, INC ]
