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XC6VLX75T-1FFG484C 参数 Datasheet PDF下载

XC6VLX75T-1FFG484C图片预览
型号: XC6VLX75T-1FFG484C
PDF下载: 下载PDF文件 查看货源
内容描述: [Field Programmable Gate Array, 1098MHz, 74496-Cell, CMOS, PBGA484, 23 X 23 MM, LEAD FREE, FBGA-484]
分类和应用: 时钟可编程逻辑
文件页数/大小: 65 页 / 1429 K
品牌: XILINX [ XILINX, INC ]
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Virtex-6 FPGA Data Sheet: DC and Switching Characteristics  
Table 59: Configuration Switching Characteristics (Cont’d)  
Speed Grade  
Symbol  
Description  
Units  
-3  
6
-2  
6
-1  
6
-1L  
7
TSMCKBY  
CCLK to BUSY out in readback at 2.5V  
CCLK to BUSY out in readback at 1.8V  
Maximum Frequency with respect to nominal CCLK  
ns, Max  
ns, Max  
6
6
6
7
FSMCCK  
FRBCCK  
100  
100  
100  
100  
100  
100  
70  
60  
MHz, Max  
MHz, Max  
Maximum Readback Frequency with respect to  
nominal CCLK  
FMCCKTOL  
Frequency tolerance, master mode with  
respect to nominal CCLK  
55  
55  
55  
60  
%
Boundary-Scan Port Timing Specifications  
TMS and TDI Setup time before TCK/ Hold time  
TTAPTCK/TTCKTAP  
3.0/2.0 3.0/2.0 3.0/2.0 4.0/2.0  
ns, Min  
after TCK  
TTCKTDO  
TCK falling edge to TDO output valid at 2.5V  
TCK falling edge to TDO output valid at 1.8V  
Maximum configuration TCK clock frequency  
6
6
6
6
6
6
7
7
ns, Max  
ns, Max  
FTCK  
66  
15  
66  
15  
66  
15  
33  
15  
MHz, Max  
MHz, Min  
FTCKB_MIN  
Minimum boundary-scan TCK clock frequency  
when using IEEE Std 1149.6 (AC-JTAG). Minimum  
operating temperature for IEEE Std 1149.6 is 0°C.  
FTCKB  
Maximum boundary-scan TCK clock frequency  
66  
66  
66  
33  
MHz, Max  
BPI Master Flash Mode Programming Switching  
(2)  
TBPICCO  
ADDR[25:0], RS[1:0], FCS_B, FOE_B, FWE_B  
outputs valid after CCLK rising edge at 2.5V  
6
6
6
6
6
6
7
7
ns  
ns  
ADDR[25:0], RS[1:0], FCS_B, FOE_B, FWE_B  
outputs valid after CCLK rising edge at 1.8V  
T
BPIDCC/TBPICCD  
Setup/Hold on D[15:0] data input pins  
4.0/0.0 4.0/0.0 4.0/0.0 5.0/0.0  
ns  
TINITADDR  
Minimum period of initial ADDR[25:0] address  
cycles  
3
3
3
3
CCLK cycles  
SPI Master Flash Mode Programming Switching  
TSPIDCC/TSPIDCCD DIN Setup/Hold before/after the rising CCLK edge 3.0/0.0 3.0/0.0 3.0/0.0 3.5/0.0  
TSPICCM  
ns  
ns  
ns  
ns  
ns  
µs  
MOSI clock to out at 2.5V  
6
6
6
6
2
6
6
6
6
2
6
6
6
6
2
7
7
7
7
2
MOSI clock to out at 1.8V  
TSPICCFC  
FCS_B clock to out at 2.5V  
FCS_B clock to out at 1.8V  
T
FSINIT/TFSINITH  
FS[2:0] to INIT_B rising edge Setup and Hold  
CCLK Output (Master Modes)  
TMCCKL  
Master CCLK clock Low time duty cycle  
45/55  
45/55  
45/55  
45/55  
45/55  
45/55  
40/60  
40/60  
%, Min/Max  
%, Min/Max  
TMCCKH  
Master CCLK clock High time duty cycle  
CCLK Input (Slave Modes)  
TSCCKL  
TSCCKH  
Slave CCLK clock minimum Low time  
Slave CCLK clock minimum High time  
2.5  
2.5  
2.5  
2.5  
2.5  
2.5  
2.5  
2.5  
ns, Min  
ns, Min  
Dynamic Reconfiguration Port (DRP) for MMCM Before and After DCLK  
FDCK  
Maximum frequency for DCLK  
DADDR Setup/Hold  
200  
200  
200  
200  
MHz  
ns  
TMMCMDCK_DADDR  
TMMCMCKD_DADDR  
/
1.25/  
0.00  
1.40/  
0.00  
1.63/  
0.00  
1.64/  
0.00  
DS152 (v3.6) March 18, 2014  
www.xilinx.com  
Product Specification  
50  
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