Pinout Descriptions
Package Overview
Table 60 shows the six low-cost, space-saving production package styles for the Spartan-3A family.
Table 60: Spartan-3A Family Package Options
(1)
Maximum Lead Pitch
Body Area
(mm)
Height
(mm)
Mass
(g)
Package
Leads
Type
I/O
(mm)
0.5
0.5
1.0
1.0
1.0
1.0
1.0
VQ100 / VQG100
TQ144 / TQG144
FT256 / FTG256
FG320 / FGG320
FG400 / FGG400
FG484 / FGG484
FG676 / FGG676
100
144
256
320
400
484
676
Very Thin Quad Flat Pack (VQFP)
Thin Quad Flat Pack (TQFP)
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14 x 14
20 x 20
17 x 17
19 x 19
21 x 21
23 x 23
27 x 27
1.20
1.60
1.55
2.00
2.43
2.60
2.60
0.6
1.4
0.9
1.4
2.2
2.2
3.4
108
195
251
311
375
502
Fine-pitch Thin Ball Grid Array (FBGA)
Fine-pitch Ball Grid Array (FBGA)
Fine-pitch Ball Grid Array (FBGA)
Fine-pitch Ball Grid Array (FBGA)
Fine-pitch Ball Grid Array (FBGA)
Notes:
1. Package mass is ±10%.
Each package style is available in an environmentally
friendly lead-free (Pb-free) option. The Pb-free packages
include an extra ‘G’ in the package style name. For example,
the standard “CS484” package becomes “CSG484” when
ordered as the Pb-free option. The mechanical dimensions
of the standard and Pb-free packages are similar, as shown
in the mechanical drawings provided in Table 61.
Mechanical Drawings
Detailed mechanical drawings for each package type are
available from the Xilinx web site at the specified location in
Table 61.
Material Declaration Data Sheets (MDDS) are also available
on the Xilinx web site for each package.
For additional package information, see UG112: Device
Package User Guide.
Table 61: Xilinx Package Documentation
Package
VQ100
Drawing
MDDS
Package Drawing
PK173_VQ100
PK130_VQG100
PK169_TQ144
PK126_TQG144
PK158_FT256
PK115_FTG256
PK152_FG320
PK106_FGG320
PK182_FG400
PK108_FGG400
PK183_FG484
PK110_FGG484
PK155_FG676
PK111_FGG676
VQG100
TQ144
Package Drawing
Package Drawing
Package Drawing
Package Drawing
Package Drawing
Package Drawing
TQG144
FT256
FTG256
FG320
FGG320
FG400
FGG400
FG484
FGG484
FG676
FGG676
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www.xilinx.com
DS529-4 (v2.0) August 19, 2010