018
Spartan-3E FPGA Family:
DC and Switching
Characteristics
R
0
0
DS312-3 (v1.0) March 1, 2005
Advance Product Specification
DC Electrical Characteristics
In this section, specifications may be designated as
Advance, Preliminary, or Production. These terms are
defined as follows:
All parameter limits are representative of worst-case supply
voltage and junction temperature conditions. The following
applies unless otherwise noted: The parameter values
published in this module apply to all Spartan™-3E
devices. AC and DC characteristics are specified using
the same numbers for both commercial and industrial
grades.
Advance: Initial estimates are based on simulation, early
characterization, and/or extrapolation from the characteris-
tics of other families. Values are subject to change. Use as
estimates, not for production.
If a particular Spartan-3E FPGA differs in functional
behavior or electrical characteristic from this data
sheet, those differences are described in a separate
errata document. The errata documents for Spartan-3E
FPGAs are living documents and are available online.
Preliminary: Based on characterization. Further changes
are not expected.
Production: These specifications are approved once the
silicon has been characterized over numerous production
lots. Parameter values are considered stable with no future
changes expected.
Table 1: Absolute Maximum Ratings
Symbol
VCCINT
VCCAUX
VCCO
Description
Internal supply voltage
Conditions
Min
–0.5
–0.5
–0.5
–0.5
–0.5
Max
1.32
Units
V
V
V
V
V
Auxiliary supply voltage
Output driver supply voltage
Input reference voltage
3.00
3.75
VREF
VCCO + 0.5(3)
VCCO + 0.5(3)
(2)
VIN
Voltage applied to all User I/O pins and
Dual-Purpose pins
Driver in a high-impedance state
Voltage applied to all Dedicated pins
Electrostatic Discharge Voltage
–0.5
–2000
–500
–200
-
VCCAUX+0.5(4)
+2000
+500
V
V
VESD
Human body model
Charged device model
Machine model
V
+200
V
TJ
Junction temperature
Storage temperature
125
°C
°C
TSTG
–65
150
Notes:
1. Stresses beyond those listed under Absolute Maximum Ratings may cause permanent damage to the device. These are stress ratings only;
functional operation of the device at these or any other conditions beyond those listed under the Recommended Operating Conditions is not
implied. Exposure to Absolute Maximum Ratings conditions for extended periods of time adversely affects device reliability.
2. As a rule, the V limits apply to both the DC and AC components of signals. Simple application solutions are available that show how to
IN
handle overshoot/undershoot as well as achieve PCI compliance. Refer to the following application notes: "Virtex™-II Pro and Spartan-3
3.3V PCI Reference Design" (XAPP653) and "Using 3.3V I/O Guidelines in a Virtex-II Pro Design" (XAPP659).
3. Each of the User I/O and Dual-Purpose pins is associated with one of the four banks’ V
rails. Meeting the V max limit ensures that the
CCO
IN
internal diode junctions that exist between these pins and their associated V
rails do not turn on. Table 4 specifies the V
range used
CCO
CCO
to determine the max limit. When V
is at its maximum recommended operating level (3.45V), V max is 3.95V. The maximum voltage
= 4.05V. As long as the V max specification is met, oxide stress is not possible.
CCO
IN
that avoids oxide stress is V
INX
IN
4. All Dedicated pins (PROG_B, DONE, TCK, TDI, TDO, and TMS) draw power from the V
rail (2.5V). Meeting the V max limit ensures
IN
CCAUX
that the internal diode junctions that exist between each of these pins and the V
rail do not turn on. Table 4 specifies the V
range
CCAUX
CCAUX
used to determine the max limit. When V
is at its maximum recommended operating level (2.625V), V max < 3.125V. As long as the
CCAUX
IN
V
max specification is met, oxide stress is not possible.
IN
5. For soldering guidelines, see "Device Packaging and Thermal Characteristics" at www.xilinx.com/bvdocs/userguides/ug112.pdf. Also see
"Implementation and Solder Reflow Guidelines for Pb-Free Packages" at www.xilinx.com/bvdocs/appnotes/xapp427.pdf.
© 2005 Xilinx, Inc. All rights reserved. XILINX, the Xilinx logo, and other designated brands included herein are trademarks of Xilinx, Inc.
All other trademarks are the property of their respective owners.
DS312-3 (v1.0) March 1, 2005
www.xilinx.com
1
Advance Product Specification
XILINX [ XILINX, INC ]
