R
Virtex™-II Platform FPGAs: Introduction and Overview
Boundary Scan
Readback and Integrated Logic Analyzer
Boundary scan instructions and associated data registers
support a standard methodology for accessing and config-
uring Virtex-II devices that complies with IEEE standards
1149.1 — 1993 and 1532. A system mode and a test mode
are implemented. In system mode, a Virtex-II device per-
forms its intended mission even while executing non-test
boundary-scan instructions. In test mode, boundary-scan
test instructions control the I/O pins for testing purposes.
The Virtex-II Test Access Port (TAP) supports BYPASS,
PRELOAD, SAMPLE, IDCODE, and USERCODE non-test
instructions. The EXTEST, INTEST, and HIGHZ test instruc-
tions are also supported.
Configuration data stored in Virtex-II configuration memory
can be read back for verification. Along with the configura-
tion data, the contents of all flip-flops/latches, distributed
SelectRAM, and block SelectRAM memory resources can
be read back. This capability is useful for real-time debug-
ging.
The Integrated Logic Analyzer (ILA) core and software pro-
vides a complete solution for accessing and verifying
Virtex-II devices.
Virtex-II Device/Package Combinations
and Maximum I/O
Wire-bond and flip-chip packages are available. Table 4 and
Table 5 show the maximum possible number of user I/Os in
wire-bond and flip-chip packages, respectively. Table 6
shows the number of available user I/Os for all device/pack-
age combinations.
Configuration
Virtex-II devices are configured by loading data into internal
configuration memory, using the following five modes:
•
•
•
•
•
Slave-serial mode
Master-serial mode
•
CS denotes wire-bond chip-scale ball grid array (BGA)
(0.80 mm pitch).
Slave SelectMAP mode
Master SelectMAP mode
Boundary-Scan mode (IEEE 1532)
•
•
•
•
FG denotes wire-bond fine-pitch BGA (1.00 mm pitch).
FF denotes flip-chip fine-pitch BGA (1.00 mm pitch).
BG denotes standard BGA (1.27 mm pitch).
A Data Encryption Standard (DES) decryptor is available
on-chip to secure the bitstreams. One or two triple-DES key
sets can be used to optionally encrypt the configuration
information.
BF denotes flip-chip BGA (1.27 mm pitch).
The number of I/Os per package include all user I/Os except
the 15 control pins (CCLK, DONE, M0, M1, M2, PROG_B,
PWRDWN_B, TCK, TDI, TDO, TMS, HSWAP_EN, DXN,
DXP, and RSVD) and VBATT.
Table 4: Wire-Bond Packages Information
Package
Pitch (mm)
CS144
0.80
FG256
1.00
FG456
1.00
FG676
1.00
BG575
1.27
BG728
1.27
Size (mm)
I/Os
12 x 12
92
17 x 17
172
23 x 23
324
27 x 27
484
31 x 31
408
35 x 35
516
Table 5: Flip-Chip Packages Information
Package FF896
Pitch (mm) 1.00
FF1152
1.00
FF1517
1.00
BF957
1.27
40 x 40
684
Size (mm)
I/Os
31 x 31
624
35 x 35
824
40 x 40
1,108
DS031-1 (v2.0) August 1, 2003
www.xilinx.com
Module 1 of 4
Product Specification
1-800-255-7778
5
XILINX [ XILINX, INC ]
