R
Pinout Descriptions
age body (case) and the die junction temperature per watt
Package Thermal Characteristics
of power consumption. The junction-to-board (θ ) value
JB
The power dissipated by an FPGA application has implica-
tions on package selection and system design. The power
consumed by a Spartan-3E FPGA is reported using either
the XPower Estimator or the XPower Analyzer calculator
integrated in the Xilinx ISE® development software.
Table 130 provides the thermal characteristics for the vari-
ous Spartan-3E package offerings.
similarly reports the difference between the board and junc-
tion temperature. The junction-to-ambient (θ ) value
JA
reports the temperature difference per watt between the
ambient environment and the junction temperature. The θ
JA
value is reported at different air velocities, measured in lin-
ear feet per minute (LFM). The “Still Air (0 LFM)” column
shows the θ value in a system without a fan. The thermal
JA
The junction-to-case thermal resistance (θ ) indicates the
difference between the temperature measured on the pack-
resistance drops with increasing air flow.
JC
Table 130: Spartan-3E Package Thermal Characteristics
Junction-to-Ambient (θ
)
JA
at Different Air Flows
Junction-to-Case Junction-to-
Still Air
(0 LFM) 250 LFM 500 LFM 750 LFM
Package
Device
(θ
)
Board (θ
)
Units
JC
JB
VQ100
XC3S100E
XC3S250E
XC3S500E
XC3S100E
XC3S250E
XC3S500E
XC3S100E
XC3S250E
XC3S250E
XC3S500E
XC3S250E
XC3S500E
XC3S1200E
XC3S500E
XC3S1200E
XC3S1600E
XC3S1200E
XC3S1600E
XC3S1600E
13.0
11.0
9.8
30.9
49.0
43.3
40.0
62.1
48.3
41.5
52.1
37.6
37.0
36.1
35.8
31.1
26.2
26.1
23.0
21.1
22.3
20.3
18.8
40.7
36.0
33.3
55.3
41.8
35.2
40.5
29.2
27.3
26.6
29.3
25.0
20.5
20.6
17.7
15.9
17.2
15.2
12.5
37.9
33.6
31.0
52.8
39.5
32.9
34.6
25.0
24.1
23.6
28.4
24.0
19.3
19.4
16.4
14.6
16.0
14.0
11.3
37.0
32.7
30.2
51.2
38.0
31.5
32.5
23.4
22.4
21.8
28.1
23.6
18.9
18.6
15.7
13.8
15.3
13.3
10.8
°C/Watt
°C/Watt
°C/Watt
°C/Watt
°C/Watt
°C/Watt
°C/Watt
°C/Watt
°C/Watt
°C/Watt
°C/Watt
°C/Watt
°C/Watt
°C/Watt
°C/Watt
°C/Watt
°C/Watt
°C/Watt
°C/Watt
25.9
CP132
19.3
11.8
8.5
42.0
28.1
21.3
31.9
25.7
29.0
26.8
27.7
22.2
16.4
15.6
12.5
10.6
12.4
10.4
9.4
TQ144
PQ208
FT256
8.2
7.2
9.8
8.5
12.4
9.6
6.5
FG320
9.8
8.2
7.1
FG400
FG484
7.5
6.0
5.7
168
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DS312-4 (v3.8) August 26, 2009
Product Specification
XILINX [ XILINX, INC ]
