QPro Virtex 2.5V Radiation-Hardened FPGAs
Table 1:
QPro Virtex FPGA Radiation-Hardened FPGA Family Members
Device
XQVR300
XQVR600
XQVR1000
System Gates CLB Array Logic Cells Maximum Available I/O Block RAM Bits Maximum Select RAM Bits
322,970
661,111
1,124,022
32x48
48x72
64x96
6,912
15,552
27,648
162
162
404
65,536
98,304
131,072
98,304
221,184
393,216
Radiation Specifications
Table 2:
Radiation Specifications
Symbol
TID
SEL
Description
Total Ionizing Dose
Method 1019, Dose Rate ~9.0 rad(Si)/sec
Single Event Latch-up Immunity
Heavy Ion Saturation Cross Section
LET > 125 MeV cm
2
/mg
Single Event Upset CLB Flip-flop
Heavy Ion Saturation Cross Section
Single Event Upset Configuration Latch
Heavy Ion Saturation Cross Section
Single Event Upset Configuration Latch
Proton (63 MeV) Saturation Cross Section
Single Event Upset Block RAM Bit
Heavy Ion Saturation Cross Section
Min
100
–
Max
–
0
Units
krad(Si)
(cm
2
/Device)
SEU
FH
SEU
CH
SEU
CP
SEU
BH
Notes:
1.
–
–
–
–
6.5E – 8
8.0E – 8
2.2E – 14
1.6E – 7
(cm
2
/Bit)
(cm
2
/Bit)
(cm
2
/Bit)
(cm
2
/Bit)
For more information, refer to “Radiation Test Results of the Virtex FPGA for Space Based Reconfigurable Computing” and “SEU Mitigation
Techniques for Virtex FPGAs in Space Applications” at
Virtex FPGA Electrical Characteristics
Based on preliminary characterization. Further changes are not expected.
All specifications are representative of worst-case supply voltage and junction temperature conditions. The parameters
included are common to popular designs and typical applications. Contact the factory for design considerations requiring
more detailed information.
DS028 (v2.1) November 5, 2010
Product Specification
2
XILINX [ XILINX, INC ]
