WM8959
Pre-Production
PACKAGE DIMENSIONS
B: 42 BALL W-CSP PACKAGE 3.226 X 3.440 X 0.7mm BODY, 0.50 mm BALL PITCH
DM049.C
6
D
A
2
DETAIL 1
6
5
4
3
2
1
G
A2
A1
CORNER
A
B
C
D
E
F
4
e
5
E1
E
G
0.10
Z
2 X
e
TOP VIEW
DETAIL 2
2 X
0.10 Z
D1
BOTTOM VIEW
f
SOLDER BALL
f
bbb
Z
h
1
Z
A1
DETAIL 2
Dimensions (mm)
Symbols
A
MIN
NOM
0.7
MAX
0.785
0.275
0.405
NOTE
0.615
0.225
0.250
A1
A2
0.355
0.380
3.226 BSC
2.500 BSC
3.440 BSC
D
D1
E
E1
e
3.00 BSC
0.50 BSC
5
f
0.060 BSC
0.035
g
h
0.070
0.105
0.315 BSC
NOTES:
1. PRIMARY DATUM -Z- AND SEATING PLANE ARE DEFINED BY THE SPHERICAL CROWNS OF THE SOLDER BALLS.
2. THIS DIMENSION INCLUDES STAND-OFF HEIGHT ‘A1’ AND BACKSIDE COATING.
3. A1 CORNER IS IDENTIFIED BY INK/LASER MARK ON TOP PACKAGE.
4. BILATERAL TOLERANCE ZONE IS APPLIED TO EACH SIDE OF THE PACKAGE BODY.
5. ‘e’ REPRESENTS THE BASIC SOLDER BALL GRID PITCH.
6. THIS DRAWING IS SUBJECT TO CHANGE WITHOUT NOTICE.
7. FOLLOWS JEDEC DESIGN GUIDE MO-211-C.
PP, May 2008, Rev 3.1
154
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WOLFSON [ WOLFSON MICROELECTRONICS PLC ]
