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WM8959 参数 Datasheet PDF下载

WM8959图片预览
型号: WM8959
PDF下载: 下载PDF文件 查看货源
内容描述: 移动多媒体DAC,具有双模式AB / D类扬声器驱动器 [Mobile Multimedia DAC with Dual-Mode Class AB/D Speaker Driver]
分类和应用: 驱动器
文件页数/大小: 155 页 / 2044 K
品牌: WOLFSON [ WOLFSON MICROELECTRONICS PLC ]
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Pre-Production  
WM8959  
RECOMMENDED EXTERNAL COMPONENTS  
DVDD  
Vbatt  
AVDD  
0.1  
F
0.1  
F
4.7  
F
4.7  
F
4.7 F  
WM8959  
AVDD  
AGND  
HPGND  
SPKGND  
DGND  
HPVDD  
SPKVDD  
DCVDD  
DBVDD  
MICBIAS  
4.7  
F
4.7 F  
MODE  
CSB/ADDR  
SCLK  
MICBIAS  
VMID  
CONTROL INTERFACE  
(2, 3 or 4-wire via GPIO)  
AGND  
SDIN  
MCLK  
LOUT  
ROUT  
16 or 32 OHM  
HEADPHONES  
220  
220  
F
F
BCLK  
DACLRC  
DACDAT  
AUDIO INTERFACE  
OUT3  
OUT4  
16 or 32 OHM  
EAR SPEAKER  
MICBIAS  
GPIO1  
GPIO3/BCLK2  
GPIO4/DACLRC2  
GPIO5/DACDAT2  
GPIO  
2k2  
2k2  
SPKP  
SPKN  
8 OHM  
LOUDSPEAKER  
LIN1  
1
F
HEADSET  
MIC  
ROP  
RON  
LOP  
LON  
LINE  
OUTPUTS  
1
F
F
F
F
LIN2  
1
1
1
F
F
F
1
1
1
LIN3/GPI7  
LIN4/RXN  
HANDSET  
MIC  
RIN1  
1
1
1
1
F
F
F
F
RIN2  
LINE INPUT  
(FM Radio)  
RIN3/GPI8  
RIN4/RXP  
LINE INPUT  
(Melody Chip)  
BB  
(Voice CODEC)  
Notes:  
1. Wolfson recommends using a single, common ground reference. Where this is not possible care should be taken to optimise split ground  
configuration for audio performance.  
2. Supply decoupling capacitors on DCVDD, DBVDD, SPKVDD, HPVDD and AVDD should be positioned as close to the WM8959 as  
possible. Values indicated are minimum requirements.  
3. Capacitor types should be carefully chosen. Capacitors with very low ESR are recommended for optimum performance.  
4. The loudspeaker should be connected as close as possible to the WM8959. When this is not possible, filtering should be placed on the  
speaker outputs close to the WM8959.  
5. The 2k2 MICBIAS resistors on each of the MIC inputs are typical values and will be suitable for many electret type microphones.  
However, it is recommended that engineers refer to individual microphone specifications prior to finalising the value of this component.  
PP, May 2008, Rev 3.1  
w
153  
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