WM8352
Production Data
30 PACKAGE DIAGRAM
B: 129 BALL BGA PLASTIC PACKAGE 7 X 7 X 0.94 mm BODY, 0.50 mm BALL PITCH
DM040.B
5
D
A
A2
2
DETAIL 1
13 12 11 10
9
8
7
6
5
4
3
2
1
A
B
C
D
E
F
A1
CORNER
4
e
6
E1
G
H
J
E
K
L
M
N
0.10
Z
2 X
e
2 X
0.10 Z
DETAIL 2
TOP VIEW
D1
SIDE VIEW
BOTTOM VIEW
SOLDER BALL
bbb
Z
Z
aaa
1
Z
b
A1
3
DETAIL 2
ccc
ddd
DETAIL 1
Z
Z
X Y
Dimensions (mm)
Symbols
MIN
0.83
0.2
NOM
MAX
NOTE
0.94
A
1.05
A1
A2
b
0.28
0.77
0.24
0.70
0.30
0.63
0.25
0.35
D
D1
E
7.00 BSC
6.00 BSC
7.00 BSC
6.00 BSC
0.50 BSC
E1
e
6
Tolerances of Form and Position
aaa
bbb
ccc
ddd
0.08
0.10
0.15
0.05
JEDEC, MO-195
REF:
NOTES:
1. PRIMARY DATUM -Z- AND SEATING PLANE ARE DEFINED BY THE SPHERICAL CROWNS OF THE SOLDER BALLS.
2. THIS DIMENSION INCLUDES STAND-OFF HEIGHT ‘A1’.
3. DIMENSION ‘b’ IS MEASURED AT THE MAXIMUM SOLDER BALL DIAMETER, PARALLEL TO PRIMARY DATUM -Z-.
4. A1 CORNER IS IDENTIFIED BY INK/LASER MARK ON TOP PACKAGE.
5. BILATERAL TOLERANCE ZONE IS APPLIED TO EACH SIDE OF THE PACKAGE BODY.
6. ‘e’ REPRESENTS THE BASIC SOLDER BALL GRID PITCH.
7. THIS DRAWING IS SUBJECT TO CHANGE WITHOUT NOTICE.
8. FALLS WITHIN JEDEC, MO-195
PD, February 2011, Rev 4.4
334
w
WOLFSON [ WOLFSON MICROELECTRONICS PLC ]
