WM2633
Production Data
PACKAGE DIMENSIONS
DT: 20 PIN TSSOP (6.5 x 4.4 x 1.0 mm)
DM008.C
b
e
20
11
E1
E
GAUGE
PLANE
θ
1
10
D
0.25
c
L
A1
A
A2
-C-
0.05 C
SEATING PLANE
Dimensions
(mm)
NOM
-----
Symbols
MIN
-----
MAX
1.20
0.15
1.05
0.30
0.20
6.60
A
A1
A2
b
c
D
e
E
E1
L
0.05
0.80
0.19
0.09
6.40
-----
1.00
-----
-----
6.50
0.65 BSC
6.4 BSC
4.40
4.30
0.45
0o
4.50
0.75
8o
0.60
-----
θ
REF:
JEDEC.95, MO-153
NOTES:
A. ALL LINEAR DIMENSIONS ARE IN MILLIMETERS.
B. THIS DRAWING IS SUBJECT TO CHANGE WITHOUT NOTICE.
C. BODY DIMENSIONS DO NOT INCLUDE MOLD FLASH OR PROTRUSION, NOT TO EXCEED 0.25MM.
D. MEETS JEDEC.95 MO-153, VARIATION = AC. REFER TO THIS SPECIFICATION FOR FURTHER DETAILS.
WOLFSON MICROELECTRONICS LTD
PD Rev 1.0 July 1999
12
WOLFSON [ WOLFSON MICROELECTRONICS PLC ]
