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W25X40BV 参数 Datasheet PDF下载

W25X40BV图片预览
型号: W25X40BV
PDF下载: 下载PDF文件 查看货源
内容描述: 1M位, 2M位和4M位串行闪存4KB扇区和双I / O SPI [1M-BIT, 2M-BIT AND 4M-BIT SERIAL FLASH MEMORY WITH 4KB SECTORS AND DUAL I/O SPI]
分类和应用: 闪存
文件页数/大小: 51 页 / 1636 K
品牌: WINBOND [ WINBOND ]
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W25X10BV/20BV/40BV  
9.2.9 Fast Read Dual Output (3Bh).........................................................................................21  
9.2.10 Fast Read Dual I/O (BBh).............................................................................................22  
9.2.11 Continuous Read Mode Bits (M7-0) .............................................................................24  
9.2.12 Continuous Read Mode Reset (FFFFh) .......................................................................24  
9.2.13 Page Program (02h).....................................................................................................25  
9.2.14 Sector Erase (20h) .......................................................................................................26  
9.2.15 32KB Block Erase (52h) ...............................................................................................27  
9.2.16 Block Erase (D8h) ........................................................................................................28  
9.2.17 Chip Erase (C7h or 60h)...............................................................................................29  
9.2.18 Power-down (B9h)........................................................................................................30  
9.2.19 Release Power-down / Device ID (ABh).......................................................................31  
9.2.20 Read Manufacturer / Device ID (90h)...........................................................................33  
9.2.21 Read Manufacturer / Device ID Dual I/O (92h).............................................................34  
9.2.22 Read Unique ID Number (4Bh).....................................................................................35  
9.2.23 JEDEC ID (9Fh) ...........................................................................................................36  
10.  
ELECTRICAL CHARACTERISTICS......................................................................................... 37  
10.1 Absolute Maximum Ratings.......................................................................................... 37  
10.2 Operating Ranges......................................................................................................... 37  
10.3 Power-up Timing and Write Inhibit Threshold .............................................................. 38  
10.4 DC Electrical Characteristics........................................................................................ 39  
10.5 AC Measurement Conditions........................................................................................ 40  
10.6 AC Electrical Characteristics ........................................................................................ 41  
10.7 AC Electrical Characteristics (cont’d) ........................................................................... 42  
10.8 Serial Output Timing..................................................................................................... 43  
10.9 Input Timing .................................................................................................................. 43  
10.10 Hold Timing ................................................................................................................. 43  
PACKAGE SPECIFICATION.................................................................................................... 44  
11.1 8-Pin SOIC 150-mil (Package Code SN)...................................................................... 44  
11.2 8-Pin SOIC 208-mil (Package Code SS)...................................................................... 45  
11.3 8-Pin PDIP 300-mil (Package Code DA)...................................................................... 46  
11.4 8-Contact 6x5mm WSON (Package Code ZP) ............................................................ 47  
ORDERING INFORMATION .................................................................................................... 49  
12.1 Valid Part Numbers and Top Side Marking .................................................................. 50  
11.  
12.  
REVISION HISTORY ............................................................................................................................ 51  
Publication Release Date: August 20, 2009  
- 3 -  
Preliminary -- Revision B  
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