W25Q16DV
9.3 8-Pin SOIC 208-mil (Package Code SS)
GAUGE PLANE
MILLIMETERS
SYMBOL
INCHES
Nom
Min
Nom
Max
Min
Max
A
A1
A2
b
C
D
D1
E
E1
e(2)
H
1.75
0.05
1.70
0.35
0.19
5.18
5.13
5.18
5.13
1.95
0.15
1.80
0.42
0.20
5.28
5.23
5.28
5.23
1.27 BSC.
7.90
0.65
---
2.16
0.25
1.91
0.48
0.25
5.38
5.33
5.38
5.33
0.069
0.002
0.067
0.014
0.007
0.204
0.202
0.204
0.202
0.077
0.006
0.071
0.017
0.008
0.208
0.206
0.208
0.206
0.050 BSC.
0.311
0.026
---
0.085
0.010
0.075
0.019
0.010
0.212
0.210
0.212
0.210
7.70
0.50
---
8.10
0.80
0.10
8°
0.303
0.020
---
0.319
0.031
0.004
8°
L
y
0°
---
0°
---
θ
Notes:
1. Controlling dimensions: millimeters, unless otherwise specified.
2. BSC = Basic lead spacing between centers.
3. Dimensions D1 and E1 do not include mold flash protrusions and should be measured from the bottom of the package.
4. Formed leads coplanarity with respect to seating plane shall be within 0.004 inches.
Publication Release Date: October 29, 2012
- 71 -
Revision D
WINBOND [ WINBOND ]
