W25Q16DV
8-Pad WSON 6x5mm Cont’d.
MILLIMETERS
Nom
INCHES
Nom
SYMBOL
Min
Max
Min
Max
SOLDER PATTERN
M
N
P
3.40
4.30
6.00
0.50
0.75
0.134
0.169
0.236
0.020
0.026
Q
R
Notes:
1. Advanced Packaging Information; please contact Winbond for the latest minimum and maximum specifications.
2. BSC = Basic lead spacing between centers.
3. Dimensions D and E do not include mold flash protrusions and should be measured from the bottom of the package.
4. The metal pad area on the bottom center of the package is connected to the device ground (GND pin). Avoid placement of
exposed PCB vias under the pad.
Publication Release Date: October 29, 2012
- 75 -
Revision D
WINBOND [ WINBOND ]
