W25Q16DV
9. PACKAGE SPECIFICATION
9.1 8-Pin SOIC 150-mil (Package Code SN)
c
8
5
E
H
E
L
1
4
θ
0.25
D
A
Y
e
SEATING PLANE
GAUGE PLANE
A1
b
MILLIMETERS
INCHES
SYMBOL
Min
Max
Min
Max
A
A1
b
1.35
0.10
0.33
0.19
3.80
4.80
1.75
0.25
0.51
0.25
4.00
5.00
0.053
0.004
0.013
0.008
0.150
0.188
0.069
0.010
0.020
0.010
0.157
0.196
c
E(3)
D(3)
e(2)
1.27 BSC
0.050 BSC
5.80
---
0.40
0°
6.20
0.10
1.27
10°
0.228
---
0.016
0°
0.244
0.004
0.050
10°
H
E
Y(4)
L
θ
Notes:
1. Controlling dimensions: millimeters, unless otherwise specified.
2. BSC = Basic lead spacing between centers.
3. Dimensions D and E do not include mold flash protrusions and should be measured from the bottom of the package.
4. Formed leads coplanarity with respect to seating plane shall be within 0.004 inches.
Publication Release Date: October 29, 2012
Revision D
- 69 -
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