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MMBT3946DW1T1 参数 Datasheet PDF下载

MMBT3946DW1T1图片预览
型号: MMBT3946DW1T1
PDF下载: 下载PDF文件 查看货源
内容描述: 双路通用晶体管 [Dual General Purpose Transistors]
分类和应用: 晶体晶体管
文件页数/大小: 11 页 / 402 K
品牌: WILLAS [ WILLAS ELECTRONIC CORP ]
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WILLAS
SOD-123
Batch process design, excellent power dissipation offers
better reverse leakage current and thermal resistance.
Dual
SURFACE MOUNT SCHOTTKY BARRIER RECTIFIERS -20V- 200V
1.0A
General Purpose Transistors
PACKAGE
FM120-M
MMBT3946DW1T1
THRU
FM1200-M
Pb Free Product
Features
Package outline
SOD-123H
Low profile surface mounted application in order to
The
MMBT3946DW1T1
device is a spin–off of our popular
optimize board space.
Low power loss, high
three–leaded device. It is designed for general
SOT–23/SOT–323
efficiency.
High current capability, low forward voltage drop.
purpose amplifier applications and is housed in the SOT–363
High surge capability.
six–leaded surface mount package.
Guardring for overvoltage protection.
By putting two discrete devices in
Ultra
package, this device is ideal for low–power surface mount
one
high-speed switching.
Silicon epitaxial planar chip, metal silicon junction.
applications where board space is at a premium.
Lead-free parts meet environmental standards of
MIL-STD-19500 /228
• h
FE
, 100–300
RoHS product for packing code suffix "G"
• Low V
, < 0.4 V
• Simplifies
data
Mechanical
Circuit Design
Halogen free product for packing code suffix "H"
CE(sat)
0.146(3.7)
0.130(3.3)
0.012(0.3) Typ.
6
5
0.071(1.8)
4
0.056(1.4)
1
2
3
: UL94-V0 rated flame
Epoxy
Reduces Board Space
retardant
Molded
Component Count
Case :
Reduces
plastic, SOD-123H
,
• Available in 8 mm, 7–inch/3,000
per
Tape and Reel
Terminals :Plated terminals, solderable
Unit
MIL-STD-750
Method 2026
• Device Marking:MMBT3946DW1T1 = 46
Polarity
RATINGS
MAXIMUM
: Indicated by cathode band
Mounting Position : Any
Rating
Symbol
Value
Collector-Emitter Voltage
gram
V
Weight : Approximated 0.011
CEO
SOT-363
0.040(1.0)
0.024(0.6)
0.031(0.8) Typ.
0.031(0.8) Typ.
We declare that the material of product
compliance with RoHS requirements.
Dimensions in inches and (millimeters)
Unit
Vdc
Pb-Free package is available
RoHS product for packing code suffix ”G”
Halogen free product for packing code suffix “H”
(NPN)
40
MAXIMUM RATINGS AND ELECTRICAL CHARACTERISTICS
(PNP)
-40
Ratings at 25℃ ambient temperature unless otherwise specified.
Single phase half wave, 60Hz, resistive of inductive
CBO
Collector-Base Voltage
V
load.
Vdc
3
2
 
 
 
 
NOTES:
(NPN)
60
SYMBOL
FM120-M
H FM130-MH
FM140-MH FM150-MH FM160-MH FM180-MH FM1100-MH FM1150-MH FM1200-MH
U
(PNP)
RATINGS
-40
Q
Marking Code
12
13
14
15
16
1
18
10
120
Q
2
115
Emitter-Base Voltage
V
EBO
Vdc
40
20
30
50
60
80
100
150
200
Maximum Recurrent Peak Reverse Voltage
V
V
RRM
(NPN)
6.0
V
14
21
28
35
42
56
70
105
140
Maximum RMS Voltage
V
RMS
V
-5.0
Maximum DC
(PNP)
Voltage
Blocking
20
30
40
50
60
80
100
150
200
V
DC
4
6
5
Collector Current-Continuous
I
C
I
O
mAdc
A
Maximum Average Forward Rectified Current
1.0
 
 
 
MBT3946DW1T1*
(NPN)
200
Peak Forward Surge Current 8.3 ms single half sine-wave
30
I
FSM
A
*Q1 PNP
-200
superimposed
(PNP)
load (JEDEC method)
on rated
Q2 NPN
 
40
Typical Thermal Resistance (Note 2)
R
Electrostatic Discharge
E
SD
ΘJA
HBM>16000,
 
V
ORDERING INFORMATION
 
 
120
Typical Junction Capacitance (Note 1)
C
J
MM>2000
 
Device
-55 to +125
-55 to +150
Shipping
Operating Temperature Range
T
J
Marking
THERMAL CHARACTERISTICS
-
65
to +175
Storage Temperature Range
TSTG
MMBT3946DW1T1
46
3000Units/Reel
Characteristic
Symbol
Max
Unit
CHARACTERISTICS
SYMBOL
FM120-MH
FM130-MH FM140-MH FM150-MH FM160-MH FM180-MH FM1100-MH
FM1150-MH
FM1200-MH
U
Total Package Dissipation
(1)
P
D
150
mW
V
0.9
Maximum Forward Voltage at 1.0A DC
0.92
V
F
0.50
0.70
0.85
T
A
= 25°C
 
0.5
Maximum Average Reverse Current at @T A=25℃
I
m
Thermal Resistance Junction
R
θJA
R
833
°C/W
10
@T A=125℃
Rated DC Blocking Voltage
to Ambient
Junction and Storage
T
J
,T
s t g
–55 to +150
°C
For capacitive load, derate current by 20%
1
1- Measured at 1 MHZ and applied reverse voltage of 4.0 VDC.
 
 
Temperature Range
2- Thermal Resistance From Junction to Ambient
1. Device mounted on FR4 glass epoxy printed circuit board using the minimum
1.
recommended footprint.
2012-
0
2012-06
WILLAS ELECTRONIC CORP.
WILLAS ELECTRONIC CORP