WED3EG7218S-JD3
White Electronic Designs
PRELIMINARY
Document Title
128MB – 16Mx72 DDR SDRAM UNBUFFERED
DRAM DIE OPTIONS:
• SAMSUNG: H-Die
• MICRON: T26Z: G-Die
Revision History
Rev #
History
Release Date Status
Rev A
Rev 0
Created Datasheet
3-6-02
11-04
Advanced
0.1 Updated IDD and CAP specs
0.2 Updated AC specs
Preliminary
0.3 Moved from Advanced to Preliminary
0.4 Added Lead-Free and RoHS note
Rev 1
Rev 2
1.0 Added JEDEC PCB option (JD3)
11-05
6-06
Preliminary
Preliminary
1.1 D3 PCB option "NOT RECOMMENDED FOR NEW
DESIGNS"
2.1 Removed "D3" package option
2.2 Added "Part Numbering Guide"
2.3 Added DRAM die options
2.4 Added DDR400 and DDR333 ICC & AC specifications
June 2006
Rev. 2
12
White Electronic Designs Corporation • (602) 437-1520 • www.wedc.com
WEDC [ WHITE ELECTRONIC DESIGNS CORPORATION ]
