WED2ZLRSP01S
White Electronic Designs
PACKAGE DIMENSION: 153 BUMP PBGA
2.33 Max
17.00
23.00
0.50 10
10.00
3.50
18.00
1.00
2.5
.60 .050
ALL LINEAR DIMENSIONS ARE IN MILLIMETERS AND PARENTHETICALLY IN INCHES
NOTE: Ball attach pad for above BGA package is 620 microns in diameter. Pad is solder mask defined.
ORDERING INFORMATION
Commercial Temp Range (0°C to 70°C)
tCD
(ns)
Clock
(MHz)
Operating
Range
Temperature
Range
Part Number
Configuration
WED2ZLRSP01S35BC
WED2ZLRSP01S38BC
WED2ZLRSP01S42BC
WED2ZLRSP01S50BC
WED2ZLRSP01S38BI
WED2ZLRSP01S42BI
WED2ZLRSP01S50BI
512K x 32/256K x 32
512K x 32/256K x 32
512K x 32/256K x 32
512K x 32/256K x 32
512K x 32/256K x 32
512K x 32/256K x 32
512K x 32/256K x 32
3.5
3.8
4.2
5.0
3.8
4.2
5.0
166
150
133
100
150
133
100
Commercial
Commercial
Commercial
Commercial
Industrial
0° - 70° C
0° - 70°C
0° - 70°C
0° - 70°C
-40° - 85°C
-40° - 85°C
-40° - 85°C
Industrial
Industrial
White Electronic Designs Corp. reserves the right to change products or specifications without notice.
April, 2002
Rev. 0
13
White Electronic Designs Corporation • (602) 437-1520 • www.wedc.com
WEDC [ WHITE ELECTRONIC DESIGNS CORPORATION ]
