W3E32M72S-XBX
White Electronic Designs
Document Title
32M x 72 DDR SDRAM, 219 PBGA Multi-Chip Package, 25mm x 32mm
Revision History
Rev #
History
Release Date Status
Rev 0
Initial Release
May 2004
Advanced
Rev 1
Changes (Pg. 1, 10, 18, 19)
January 2005
Final
1.1 Update capacitance table values
1.2 Update thermal resistance table values
1.3 Change max storage temperature to 125°C
1.4 Change package typical weight to 3.0g.
Rev 2
Changes (Pg. All)
March 2006
Final
2.1 All 333Mbs option
White Electronic Designs Corp. reserves the right to change products or specifications without notice.
March 2006
Rev. 2
19
White Electronic Designs Corporation • (602) 437-1520 • www.wedc.com
WEDC [ WHITE ELECTRONIC DESIGNS CORPORATION ]
