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5962-9461108HXC 参数 Datasheet PDF下载

5962-9461108HXC图片预览
型号: 5962-9461108HXC
PDF下载: 下载PDF文件 查看货源
内容描述: [Cache SRAM Module, 512KX32, 25ns, CMOS, CPGA66, HEX-IN-LINE, SINGLE CAVITY, WITH STANDOFFS-66]
分类和应用: 静态存储器
文件页数/大小: 40 页 / 287 K
品牌: WEDC [ WHITE ELECTRONIC DESIGNS CORPORATION ]
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Case outline M - Continued.  
Symbol  
Millimeters  
Inches  
Min  
Max  
5.08  
4.72  
0.64  
0.43  
Min  
.123  
.118  
.000  
.013  
Max  
.200  
.186  
.025  
.017  
A
A1  
3.12  
2.30  
0.00  
0.33  
A2  
b
B
0.25 REF  
.010 REF  
c
0.15  
0.30  
.006  
.012  
D/E  
D1/E1  
D2/E2  
D3/E3  
e
20.32 BSC  
.800 BSC  
22.10  
24.89  
23.77  
22.61  
25.40  
24.28  
.870  
.980  
.936  
.890  
1.000  
.956  
1.27 BSC  
.050 BSC  
R
0.13  
0.89  
.005  
.035  
L1  
1.14  
.045  
NOTES:  
1. The U.S. preferred system of measurement is the metric SI. This item was designed using inch-pound units of  
measurement. In case of problems involving conflicts between the metric and inch-pound units, the inch-pound  
units shall rule.  
2. Pin numbers are for reference only.  
3. Case outline M may either be a single cavity or a dual cavity package. Dimension A2 is measured between the  
lowest horizontal plane of the package and the seating plane of the lead(s).  
FIGURE 1. Case outline(s) - Continued.  
SIZE  
STANDARD  
MICROCIRCUIT DRAWING  
5962-94611  
A
REVISION LEVEL  
SHEET  
DEFENSE SUPPLY CENTER COLUMBUS  
COLUMBUS, OHIO 43216-5000  
15  
R
DSCC FORM 2234  
APR 97  
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