Multilayer Ceramic Capacitors
Approval Sheet
b.) Reflow soldering :
Fig. 4.2 Reflow soldering profile
For Sn/Ag/Cu Series solder paste (Pb-Free)
◙ Cooling
After soldering, cool the chips and the substrate gradually to room temperature. Natural cooling in air is
recommended to minimize stress in the solder joint.
◙ Cleaning
All flux residues must be removed by using suitable electronic-grade vapor-cleaning solvents to eliminate
contamination that could cause electrolytic surface corrosion. Good results can be obtained by using
ultrasonic cleaning of the solvent. The choice of the proper system is depends upon many factors such as
component mix, flux, and solder paste and assembly method. The ability of the cleaning system to remove
flux residues and contamination from under the chips is very important.
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ASC Safety Certified X2_(S3)_011Y_AS
May. 2019