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S355N0R5K252CG 参数 Datasheet PDF下载

S355N0R5K252CG图片预览
型号: S355N0R5K252CG
PDF下载: 下载PDF文件 查看货源
内容描述: [High reliability and stability]
分类和应用:
文件页数/大小: 11 页 / 1787 K
品牌: WALSIN [ Walsin Technology ]
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Multilayer Ceramic Capacitors  
Approval Sheet  
b.) Reflow soldering :  
Fig. 4.2 Reflow soldering profile  
For Sn/Ag/Cu Series solder paste (Pb-Free)  
Cooling  
After soldering, cool the chips and the substrate gradually to room temperature. Natural cooling in air is  
recommended to minimize stress in the solder joint.  
Cleaning  
All flux residues must be removed by using suitable electronic-grade vapor-cleaning solvents to eliminate  
contamination that could cause electrolytic surface corrosion. Good results can be obtained by using  
ultrasonic cleaning of the solvent. The choice of the proper system is depends upon many factors such as  
component mix, flux, and solder paste and assembly method. The ability of the cleaning system to remove  
flux residues and contamination from under the chips is very important.  
Page 11 of 11  
ASC Safety Certified X2_(S3)_011Y_AS  
May. 2019  
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